Wiring substrate and manufacturing method for wiring substrate
US-9084371-B2 · Jul 14, 2015 · US
Hayakawa Takahiro was listed as an assignee on 2 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Hayakawa Takahiro |
| Year | 2015 |
| Patents | 2 |
Representative publications for Hayakawa Takahiro in 2015.
US-9084371-B2 · Jul 14, 2015 · US
US-8963672-B2 · Feb 24, 2015 · US
Most common classification codes for Hayakawa Takahiro in 2015.
| CPC | Patents |
|---|---|
| H05K2201/09745 | 2 |
| H01F27/2804 | 1 |
| H01L23/3677 | 1 |
| H01L23/49827 | 1 |
| H01L23/49861 | 1 |
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