Inverter power module
US-2024258196-A1 · Aug 1, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L23/49861 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,116 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 49 |
| 2016 | 75 |
| 2017 | 109 |
| 2018 | 105 |
| 2019 | 85 |
| 2020 | 120 |
| 2021 | 132 |
| 2022 | 114 |
| 2023 | 104 |
| 2024 | 121 |
| 2025 | 87 |
| 2026 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for fabricating a semiconductor device including an embedded semiconductor die
US-2024250004-A1 · Jul 25, 2024 · US
Method for making semiconductor device with sidewall recess and related devices
US-2016379916-A1 · Dec 29, 2016 · US
Semiconductor module and drive device equipped with semiconductor module
US-2016351480-A1 · Dec 1, 2016 · US
Power module
US-9418921-B2 · Aug 16, 2016 · US
Interposer having molded low CTE dielectric
US-9406532-B2 · Aug 2, 2016 · US
Package in package (PiP) electronic device and manufacturing method thereof
US-9397068-B2 · Jul 19, 2016 · US
Semiconductor device
US-9379096-B2 · Jun 28, 2016 · US
Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US-9362473-B2 · Jun 7, 2016 · US
Land structure for semiconductor package and method therefor
US-9293398-B2 · Mar 22, 2016 · US
Semiconductor package having overhang portion
US-9281267-B1 · Mar 8, 2016 · US
Power semiconductor module
US-9226430-B2 · Dec 29, 2015 · US
Integrated circuit packaging system with terminals and method of manufacture thereof
US-9219029-B2 · Dec 22, 2015 · US
Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
US-9214414-B2 · Dec 15, 2015 · US
Electrical component and method of producing electrical components
US-9209367-B2 · Dec 8, 2015 · US
Lead frame and a method of manufacturing thereof
US-9202712-B2 · Dec 1, 2015 · US
Power module package and method for manufacturing the same
US-9202798-B2 · Dec 1, 2015 · US
Chip package with passives
US-9190389-B2 · Nov 17, 2015 · US
Semiconductor device leadframe
US-9190350-B2 · Nov 17, 2015 · US
Semiconductor device and lead frame used for the same
US-9177900-B2 · Nov 3, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L23/49861?
- CPC H01L23/49861 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L23/49861 (Electricity)?
- Our database includes 1,116 publications tagged with this CPC code.
- Is patent activity under CPC H01L23/49861 growing?
- Publication counts under this code: 121 in 2024 vs 87 in 2025 (latest complete years).