Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
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Hirohata Kenji patents in 2017
Hirohata Kenji was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Hirohata Kenji |
| Year | 2017 |
| Patents | 1 |
Patents
Representative publications for Hirohata Kenji in 2017.
Top CPC classifications
Most common classification codes for Hirohata Kenji in 2017.
| CPC | Patents |
|---|---|
| H01L2224/32225 | 1 |
| H01L2924/15311 | 1 |
| H05K1/0268 | 1 |
| H05K1/0293 | 1 |
| H05K2201/10734 | 1 |
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