Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
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Hirohata Kenji — Electricity
Hirohata Kenji holds 7 patents in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Hirohata Kenji |
| Technology | Electricity |
| Patents in slice | 7 |
| Recent patents in slice | 0 |
| First year | 2015 |
| Last year | 2017 |
Representative patents
Notable publications linking Hirohata Kenji to Electricity.
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Recent filings
Latest patents from Hirohata Kenji in Electricity.
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
Substrate and method for mounting semiconductor package
US-9699891-B2 · Jul 4, 2017 · US
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