Method of producing a semiconductor package
US-9842792-B2 · Dec 12, 2017 · US
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Utac Headquarters Pte Ltd patents in 2017
Utac Headquarters Pte Ltd was listed as an assignee on 18 patent publications in 2017.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2017 |
| Patents | 18 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2017.
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-2017352554-A1 · Dec 7, 2017 · US
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-2017352610-A1 · Dec 7, 2017 · US
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-2017352555-A1 · Dec 7, 2017 · US
Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US-9805955-B1 · Oct 31, 2017 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2017.
| CPC | Patents |
|---|---|
| H10W72/0198 | 12 |
| H10W74/129 | 12 |
| H10W74/014 | 11 |
| H10W90/756 | 11 |
| H10P54/00 | 10 |
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