Method of fabricating a semiconductor device with encapsulant
US-9287206-B2 · Mar 15, 2016 · US
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Escher-Poeppel Irmgard patents
Escher-Poeppel Irmgard holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Sep 8, 2015 |
| Latest publication | Mar 15, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Methods for manufacturing a chip package
US-9230894-B2 · Jan 5, 2016 · US
Method for manufacturing an electronic module and an electronic module
US-9129959-B2 · Sep 8, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of fabricating a semiconductor device with encapsulant
US-9287206-B2 · Mar 15, 2016 · US
Methods for manufacturing a chip package
US-9230894-B2 · Jan 5, 2016 · US
Method for manufacturing an electronic module and an electronic module
US-9129959-B2 · Sep 8, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/9413 | 3 |
| H10W72/0198 | 3 |
| H10W70/60 | 3 |
| H10W74/014 | 3 |
| H01L21/561 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |