Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects
US-9548269-B2 · Jan 17, 2017 · US
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Chawla Jasmeet S patents
Chawla Jasmeet S holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Jun 9, 2015 |
| Latest publication | Jan 17, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects
US-9548269-B2 · Jan 17, 2017 · US
Diagonal hardmasks for improved overlay in fabricating back end of line (BEOL) interconnects
US-9209077-B2 · Dec 8, 2015 · US
Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches
US-9054164-B1 · Jun 9, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W20/0693 | 3 |
| H10P76/4085 | 3 |
| H10P50/73 | 3 |
| H10W20/069 | 3 |
| H10W20/089 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |