Low fabrication cost, high performance, high reliability chip scale package
US-9369175-B2 · Jun 14, 2016 · US
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Huang Ching-Cheng patents
Huang Ching-Cheng holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Apr 28, 2015 |
| Latest publication | Jun 14, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Integrated chip package structure using silicon substrate and method of manufacturing the same
US-9136246-B2 · Sep 15, 2015 · US
Chip package with die and substrate
US-9030029-B2 · May 12, 2015 · US
Chip package
US-9018774-B2 · Apr 28, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Low fabrication cost, high performance, high reliability chip scale package
US-9369175-B2 · Jun 14, 2016 · US
Integrated chip package structure using silicon substrate and method of manufacturing the same
US-9136246-B2 · Sep 15, 2015 · US
Chip package with die and substrate
US-9030029-B2 · May 12, 2015 · US
Chip package
US-9018774-B2 · Apr 28, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |