Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation
US-9136144-B2 · Sep 15, 2015 · US
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Lee Sungyoon patents
Lee Sungyoon holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Mar 31, 2015 |
| Latest publication | Sep 15, 2015 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 2 |
| Year | Patents |
|---|---|
| 2015 | 2 |
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| B24B7/228 | 1 |
| H10W74/00 | 1 |
| H10W74/142 | 1 |
| H10W90/22 | 1 |
| H10W72/0198 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 1 |
| Electricity | 1 |