Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package
US-9299602-B2 · Mar 29, 2016 · US
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Hlad Mark S patents
Hlad Mark S holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Nov 24, 2015 |
| Latest publication | Mar 29, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Non-cylindrical conducting shapes in multilayer laminated substrate cores
US-9198293-B2 · Nov 24, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package
US-9299602-B2 · Mar 29, 2016 · US
Organic thin film passivation of metal interconnections
US-9257276-B2 · Feb 9, 2016 · US
Non-cylindrical conducting shapes in multilayer laminated substrate cores
US-9198293-B2 · Nov 24, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |