Sintered body, sputtering target and molding die, and process for producing sintered body employing the same
US-9920420-B2 · Mar 20, 2018 · US
Shibutami Tetsuo was listed as an assignee on 1 patent publication in 2018.
| Metric | Value |
|---|---|
| Company | Shibutami Tetsuo |
| Year | 2018 |
| Patents | 1 |
Representative publications for Shibutami Tetsuo in 2018.
Most common classification codes for Shibutami Tetsuo in 2018.
| CPC | Patents |
|---|---|
| B22F2998/00 | 1 |
| B22F2998/10 | 1 |
| B22F3/02 | 1 |
| B22F3/04 | 1 |
| B22F3/10 | 1 |
Navigate to parent entity pages.