Sintered body, sputtering target and molding die, and process for producing sintered body employing the same

US9920420B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9920420-B2
Application numberUS-201514805107-A
CountryUS
Kind codeB2
Filing dateJul 21, 2015
Priority dateFeb 1, 2005
Publication dateMar 20, 2018
Grant dateMar 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members configured to be movable relative to each other to accommodate an expansion of a green body which takes place at the time of reducing the pressure after the completion of pressing.

First claim

Opening claim text (preview).

The invention claimed is: 1. A process for producing an ITO sintered body, which comprises: providing a raw material powder which lacks a molding aid containing an organic substance; pressing the raw material powder in only a uniaxial direction to form a compressed green body; releasing the pressure on said compressed green body isotropically; and firing the green body to form the ITO sintered body. 2. The process for producing the ITO sintered body according to claim 1 , wherein the raw material powder is molded directly by a cold isostatic press to obtain the green body. 3. The process for producing the ITO sintered body according to claim 2 , wherein a molding die, for compression molding is used, wherein said molding die is a molding die for producing said compressed green body by filling and compressing a raw material powder in the molding die and which is characterized by having such a construction that at the time of pressure compression, pressing is applied to the filled raw material powder in only the uniaxial direction, and at the time of reducing the pressure after the completion of pressing, the pressure can be released isotropically with respect to said compressed green body. 4. A process for producing an ITO sintered body, which comprises: providing a raw material powder which lacks a molding aid containing an organic substance; pressing the raw material powder in only a uniaxial direction to form a compressed green body; and releasing the pressure on said compressed green body isotropically; wherein the process lacks a firing step intended to remove the organic substance from said compressed green body. 5. The process for producing the ITO sintered body according to claim 4 , wherein a raw material powder having an organic substance content of 0.6 wt % or less, is used. 6. The process for producing the ITO sintered body according to claim 4 , wherein a molding die, for compression molding is used, wherein said molding die is a molding die for producing said compressed green body by filling and compressing a raw material powder in the molding die and which is characterized by having such a construction that at the time of pressure compression, pressing is applied to the filled raw material powder in only the uniaxial direction, and at the time of reducing the pressure after the completion of pressing, the pressure can be released isotropically with respect to said compressed green body.

Assignees

Inventors

Classifications

  • of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title

  • Heating rate · CPC title

  • Density · CPC title

  • using elastic mould parts · CPC title

  • Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina · CPC title

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What does patent US9920420B2 cover?
Provided is an apparatus that includes a molding die for producing a sintered body. The molding die is configured for cold isostatic pressing and includes a knockdown mold frame comprised of plural frame members and a bottom plate provided in contact with the knockdown mold frame. An upper punch is provided to be movable along the inner surface of the knockdown mold frame. The frame members con…
Who is the assignee on this patent?
Itoh Kenichi, Mesuda Masami, Nagayama Hitoshi, and 3 more
What technology area does this patent fall under?
Primary CPC classification C23C14/3414. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).