Method and device for permanent bonding of wafers, as well as cutting tool
US-9067363-B2 · Jun 30, 2015 · US
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Rebhan Bernhard patents in 2015
Rebhan Bernhard was listed as an assignee on 2 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Rebhan Bernhard |
| Year | 2015 |
| Patents | 2 |
Patents
Representative publications for Rebhan Bernhard in 2015.
Device and method for bonding substrates
US-2015069115-A1 · Mar 12, 2015 · US
Top CPC classifications
Most common classification codes for Rebhan Bernhard in 2015.
| CPC | Patents |
|---|---|
| B23K20/24 | 2 |
| B23K20/00 | 1 |
| B23K20/023 | 1 |
| B23K20/14 | 1 |
| B23K20/22 | 1 |
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