Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
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Martinschitz Klaus patents in 2018
Martinschitz Klaus was listed as an assignee on 1 patent publication in 2018.
| Metric | Value |
|---|---|
| Company | Martinschitz Klaus |
| Year | 2018 |
| Patents | 1 |
Patents
Representative publications for Martinschitz Klaus in 2018.
Top CPC classifications
Most common classification codes for Martinschitz Klaus in 2018.
| CPC | Patents |
|---|---|
| B23K20/021 | 1 |
| B23K20/023 | 1 |
| B23K2101/40 | 1 |
| B23K35/001 | 1 |
| B23K35/0255 | 1 |
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