Method and device for permanent bonding of wafers, as well as cutting tool
US-9067363-B2 · Jun 30, 2015 · US
Martinschitz Klaus was listed as an assignee on 1 patent publication in 2015.
| Metric | Value |
|---|---|
| Company | Martinschitz Klaus |
| Year | 2015 |
| Patents | 1 |
Representative publications for Martinschitz Klaus in 2015.
Most common classification codes for Martinschitz Klaus in 2015.
| CPC | Patents |
|---|---|
| B23K20/00 | 1 |
| B23K20/023 | 1 |
| B23K20/22 | 1 |
| B23K20/24 | 1 |
| B23K2101/40 | 1 |
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