Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
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Martinschitz Klaus — Electricity
Martinschitz Klaus holds 1 patent in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Martinschitz Klaus |
| Technology | Electricity |
| Patents in slice | 1 |
| Recent patents in slice | 0 |
| First year | 2018 |
| Last year | 2018 |
Representative patents
Notable publications linking Martinschitz Klaus to Electricity.
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Recent filings
Latest patents from Martinschitz Klaus in Electricity.
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US-10163681-B2 · Dec 25, 2018 · US
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