Method for manufacturing bonded wafer and bonded SOI wafer
US-8987109-B2 · Mar 24, 2015 · US
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Yokokawa Isao patents
Yokokawa Isao holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Feb 17, 2015 |
| Latest publication | Mar 24, 2015 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 3 |
| Year | Patents |
|---|---|
| 2015 | 3 |
Recent patents
Latest publications where this party is an assignee.
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer
US-8962352-B2 · Feb 24, 2015 · US
Method for manufacturing SOI wafer
US-8956951-B2 · Feb 17, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method for manufacturing bonded wafer and bonded SOI wafer
US-8987109-B2 · Mar 24, 2015 · US
Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer
US-8962352-B2 · Feb 24, 2015 · US
Method for manufacturing SOI wafer
US-8956951-B2 · Feb 17, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Physics | 1 |
| Cross-Sectional Technologies | 1 |