Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
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Kim Sang Il — Electricity
Kim Sang Il holds 1 patent in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Kim Sang Il |
| Technology | Electricity |
| Patents in slice | 1 |
| Recent patents in slice | 0 |
| First year | 2018 |
| Last year | 2018 |
Representative patents
Notable publications linking Kim Sang Il to Electricity.
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Recent filings
Latest patents from Kim Sang Il in Electricity.
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
Packaged semiconductor chips having heat dissipation layers and ground contacts therein
US-9978661-B2 · May 22, 2018 · US
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