Method of bonding a substrate to a semiconductor light emitting device
US-10158049-B2 · Dec 18, 2018 · US
Martin Paul Scott holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | May 24, 2016 |
| Latest publication | Dec 18, 2018 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
Representative or frequently cited publications from precomputed assignee stats.
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |
| Mechanical Engineering | 1 |
| Cross-Sectional Technologies | 1 |