Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
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Nippon Steel Chemical & Mat Co Ltd patents in 2026
Nippon Steel Chemical & Mat Co Ltd was listed as an assignee on 10 patent publications in 2026.
| Metric | Value |
|---|---|
| Company | Nippon Steel Chemical & Mat Co Ltd |
| Year | 2026 |
| Patents | 10 |
Patents
Representative publications for Nippon Steel Chemical & Mat Co Ltd in 2026.
Power-generating magnetostrictive element and magnetostrictive power generation device
US-12588420-B2 · Mar 24, 2026 · US
Luminescent material, and organic electroluminescent element
US-2026082760-A1 · Mar 19, 2026 · US
Bonding wire for semiconductor devices
US-12581982-B2 · Mar 17, 2026 · US
Method for producing resources from seaweed
US-2026062621-A1 · Mar 5, 2026 · US
Top CPC classifications
Most common classification codes for Nippon Steel Chemical & Mat Co Ltd in 2026.
| CPC | Patents |
|---|---|
| C09K11/06 | 4 |
| H10K2101/90 | 4 |
| H10K50/11 | 4 |
| H10K50/12 | 4 |
| H10K85/654 | 4 |
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