Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
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Nippon Steel Chemical & Mat Co Ltd — Chemistry & Metallurgy
Nippon Steel Chemical & Mat Co Ltd holds 265 patents in Chemistry & Metallurgy, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Nippon Steel Chemical & Mat Co Ltd |
| Technology | Chemistry & Metallurgy |
| Patents in slice | 265 |
| Recent patents in slice | 107 |
| First year | 2019 |
| Last year | 2026 |
Representative patents
Notable publications linking Nippon Steel Chemical & Mat Co Ltd to Chemistry & Metallurgy.
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Recent filings
Latest patents from Nippon Steel Chemical & Mat Co Ltd in Chemistry & Metallurgy.
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Related pages
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