Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
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Andideh Ebrahim — Electricity
Andideh Ebrahim holds 1 patent in Electricity, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Andideh Ebrahim |
| Technology | Electricity |
| Patents in slice | 1 |
| Recent patents in slice | 0 |
| First year | 2016 |
| Last year | 2016 |
Representative patents
Notable publications linking Andideh Ebrahim to Electricity.
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Recent filings
Latest patents from Andideh Ebrahim in Electricity.
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer
US-9520350-B2 · Dec 13, 2016 · US
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