Method of modifying a solid using laser light

Patent metadata

Field	Value
Publication number	US-RE50809-E
Application number	US-202318322982-A
Country	US
Kind code	E1
Filing date	May 24, 2023
Priority date	Jan 15, 2015
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

The invention relates to a method for creating a detachment zone ( 2 ) in a solid ( 1 ) in order to detach a solid portion ( 12 ), especially a solid layer ( 12 ), from the solid ( 1 ), said solid portion ( 12 ) that is to be detached being thinner than the solid from which the solid portion ( 12 ) has been removed. The method according to the invention preferably comprises at least the steps of: providing a solid ( 1 ) which is to be processed and which is made of a chemical compound; providing a LASER light source; and subjecting the solid ( 1 ) to LASER radiation from the LASER light source so that the laser beams penetrate into the solid ( 1 ) via a surface ( 5 ) of the solid portion ( 12 ) that is to be cut off; the LASER radiation controlling the temperature of a predefined portion of the solid ( 1 ) inside the solid ( 1 ) in a defined manner such that a detachment zone ( 2 ) or a plurality of partial detachment zones ( 25, 27, 28, 29 ) is formed; characterized in that the temperature produced by the laser beams in a predefined portion of the solid ( 1 ) is so high that the material forming the predefined portion is subject to modifications ( 9 ) in the form of a predetermined conversion of material.

First claim

The invention claimed is:

1 . A method, comprising:
directing laser light from a laser light source into a solid surface of a solid, the laser light controlling a temperature of a predefined portion of the solid, the temperature controlled by the laser light subjecting a material of the solid which forms the predefined portion to modifications which convert the material; and moving the solid in a translational manner with respect to the laser light source such that a number of the modifications per cm2 of the solid surface per translational movement, through which the laser light penetrates into the solid to generate the modifications, is below a predefined maximum number, wherein a maximum number of the modifications per cm2 and per the translational movement is determined as a function of the material and of an energy density of the laser light, wherein the number of generated modifications per cm 2 is different in at least two different zones of the solid, wherein a first block of modifications is generated in a first zone and spaced apart from one another by less than 20 μm, wherein a second block of modifications is generated in a second zone and spaced apart from one another by less than 20 μm, wherein the first zone and the second zone are spaced apart from one another by a third zone, wherein fewer modifications as compared to the first zone or the second zone per cm 2 are generated in the third zone by the laser light, wherein the first zone is spaced apart from the second zone by more than 20 μm.

2 . The method of claim 1 , wherein the material of the solid is selected from the group consisting of a third, fourth and/or fifth main group of the periodic table of elements and/or from the 12 th subgroup of the periodic table of elements.

3 . The method of claim 1 , further comprising:
connecting the solid to a cooling device; and operating the cooling device during application of the laser light to the solid.

4 . The method of claim 3 , wherein the cooling device has at least one sensor device for capturing the temperature of the solid and, as a function of a predefined temperature course, effects a cool-down of the solid.

5 . The method of claim 3 , further comprising:
coupling the cooling device to a rotating means; and rotating the cooling device with the solid arranged thereon by the rotating means during generation of the modifications.

6 . The method of claim 1 , wherein the solid is subjected to consecutive rotations with respect to the laser light source, and wherein the modifications are generated with different patterns, in response to the consecutive rotations of the solid with respect to the laser light source.

7 . The method of claim 1 , wherein the laser light source is a laser light scanner, and wherein generation of the modifications is a function of a laser scanning direction of the laser light scanner, a laser polarization direction and crystal orientation of the material of the solid.

8 . The method of claim 1 , wherein a distance between centers of two modifications, which are generated consecutively in a modification generating direction or in a circumferential direction of the solid, is less than 10000 nm.

9 . The method of claim 1 , wherein an outer limitation of the modifications, which are generated consecutively in a modification generating direction or in a circumferential direction of the solid, are spaced apart from one another by less than 10000 nm.

10 . The method of claim 1 , wherein the number of generated modifications per cm 2 is different in at least two different zones of the solid, wherein a first block of modifications is generated in a first zone and spaced apart from one another by less than 20 μm, wherein a second block of modifications is generated in a second zone and spaced apart from one another by less than 20 μm, wherein the first zone and the second zone are spaced apart from one another by a third zone, wherein fewer modification as compared to the first zone or the second zone per cm 2 are generated in the third zone by the laser light, and wherein the first zone is spaced apart from the second zone by more than 20 μm.

11 . The method of claim 10 1 , further comprising:
generating the modifications at least in the first block of modifications and in the second block of modifications in pulse intervals of between 0.01 μm and 10 μm.

12 . The method of claim 10 1 , further comprising:
generating the modifications at least in the first block of modifications and in the second block of modifications in line spacings of between 0.01 μm and 20 μm.

13 . The method of claim 10 1 , further comprising:
generating the modifications at least in the first block of modifications and in the second block of modifications at a pulse repetition frequency of between 16 kHz and 20 MHz.

14 . The method of claim 1 , further comprising:
providing an optics for guiding the laser light from the laser light source to the solid; and adapting the optics as a function of a location at which a modification is generated, from
which at least one change of a numerical aperture of the optics is effected,
wherein the numerical aperture at a location in an edge zone of the solid is smaller than at a different location of the solid, which is located closer to a center of the solid.

15 . A method, comprising:
directing laser light from a laser light source into a solid surface of a solid, the laser light controlling a temperature of a predefined portion of the solid such that a detachment zone is formed in the solid, the temperature controlled by the laser light subjecting a material of the solid which forms the predefined portion to modifications which convert the material; connecting the solid to a cooling device; operating the cooling device during application of the laser light to the solid; expanding a crack in the solid along the detachment zone to separate a solid portion from the solid along the crack; and after the solid portion separates from the solid along the crack, again directing laser light from the laser light source into the solid to control the temperature of an additional predefined portion of the solid such that an additional detachment zone is formed, the temperature subjecting a material of the additional predefined portion of the solid to a predetermined material conversion.

16 . The method of claim 15 , further comprising:
connecting the solid to a cooling device; and operating the cooling device during application of the laser light to the solid.

17 . The method of claim 16 15 , wherein the cooling device has at least one sensor device for capturing the temperature of the solid and, as a function of a predefined temperature course, effects a cool-down of the solid.

18 . The method of claim 16 15 , further comprising:
coupling the cooling device to a rotating means; and rotating the cooling device with the solid arranged thereon by the rotating means during generation of the modifications.

19 . A method, comprising:
directing laser light from a laser light source into a solid surface of a solid, the laser light controlling a temperature of a predefined portion of the solid, the temperature controlled by the laser light subjecting a material of the solid which forms the predefined portion to modifications which convert the material; connecting the solid to a cooling device; operating the cooling device during application of the laser light to the solid; and rotating or moving the solid in a trans

Assignees

• Siltectra Gmbh

Inventors

• Beyer Christian

Classifications

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K2103/56

  being semiconducting · CPC title

• B23K26/53 Primary

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title