Heat sink system having thermally conductive rods

Patent metadata

Field	Value
Publication number	US-RE49216-E
Application number	US-201615260304-A
Country	US
Kind code	E1
Filing date	Sep 8, 2016
Priority date	Jun 24, 2008
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A heat sink system to conduct heat away from a printed circuit board assembly is provided. The heat sink system includes a chassis, a chassis cover, at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, a plurality of thermally conductive through-rods, and at least one thermally conductive notch-rod associated with a respective thermally conductive block. The at least one thermally conductive block is in thermal contact with a portion of the chassis. The plurality of thermally conductive through-rods and at least one thermally conductive notch-rod each have a first end and a second end. The through-rods are positioned in holes formed in the printed circuit board. The notch-rods are positioned in a notch formed in the printed circuit board assembly. The first ends thermally contact the thermally conductive block and the second ends thermally contact the chassis cover.

First claim

What is claimed is:

1. A heat sink system to conduct heat away from a printed circuit board assembly, the heat sink system comprising:
a chassis;
a chassis cover to overlay a portion of the chassis, wherein the printed circuit board assembly is enclosed in the chassis;
at least one thermally conductive block underlaying a high-heat section of the printed circuit board assembly, the at least one thermally conductive block in thermal contact with a respective at least one portion of the chassis;
a plurality of thermally conductive through-rods each having a first end and a second end, wherein the plurality of first ends thermally contact one of the at least one thermally conductive block and wherein the plurality of second ends thermally contact the chassis cover, wherein the plurality of through-rods are positioned in a respective plurality of holes formed in the printed circuit board; and
at least one thermally conductive notch-rod associated with a respective thermally conductive block, the at least one thermally conductive notch-rod having a first end and a second end, wherein the at least one first end of the at least one thermally conductive notch-rod thermally contacts the associated thermally conductive block and wherein the at least one second end thermally contacts the chassis cover, wherein the at least one notch-rod is positioned in a notch formed in the printed circuit board assembly.

2. The heat sink system of claim 1 , wherein:
heat is conducted from the printed circuit board assembly to the plurality of through-rods to the chassis cover;
heat is conducted from the printed circuit board assembly to the plurality of through-rods to one of the at least one thermally conductive block to the chassis; and
heat is conducted from the printed circuit board assembly to the plurality of through-rods to one of the at least one thermally conductive block to the at least one notch-rod to the chassis cover.

3. The heat sink system of claim 2 , wherein the at least one thermally conductive block is thermally coupled to a heat pipe, wherein heat is conducted from the printed circuit board assembly to the plurality of through-rods to one of the at least one thermally conductive block to the heat pipe, wherein heat is directed to a low-heat section within the chassis.

4. The heat sink system of claim 1 , wherein the plurality of first ends of the respective plurality of through-rods and the at least one notch-rod have threads, wherein the plurality of first ends of the respective plurality of through-rods screw into a respective plurality of threaded holes formed in the at least one thermally conductive block, and wherein the at least one first end of the at least one notch-rod screws into at least one respective threaded hole in the at least one thermally conductive block.

5. The heat sink system of claim 1 , wherein the plurality of second ends of the plurality of through-rods have threaded holes formed therein to accept screws, wherein the chassis cover has through-holes formed therein for the screws, and wherein the chassis cover is secured to the plurality of through-rods when the screws inserted through the through-holes in the chassis cover are screwed into the threaded holes in the second ends of the plurality of through-rods, and wherein the second end of each of the at least one notch-rod has a threaded hole formed therein to accept the screw, and wherein the chassis cover is secured to the at least one notch-rod when the screw inserted through a through-hole in the chassis cover is screwed into the threaded hole in the second end of the at least one notch-rod.

6. The heat sink system of claim 1 , wherein the at least one thermally conductive block includes a thermally conductive interface that thermally contacts the at least one portion of the chassis, wherein the at least one thermally conductive notch-rod thermally contacts the thermally conductive interface of the at least one thermally conductive block.

7. The heat sink system of claim 1 , wherein the plurality of through-rods and the at least one notch-rod are formed from aluminum.

8. The heat sink system of claim 1 , wherein the at least one thermally conductive block is formed from aluminum.

9. The heat sink system of claim 1 , wherein each of the plurality of thermally conductive blocks is thermally contacted by at least one thermally conductive notch-rod.

10. A heat sink system comprising:
a printed circuit board having a first surface and a second surface, the first surface having at least one high-heat component mounted thereon; at least one thermally conductive block interfacing with the second surface and underlaying the high-heat component; a plurality of thermally conductive rods extending out from a surface of the thermally conductive block and each defining a heat transfer path conducting heat away from the high-heat component to at least one heat sinking element, wherein the plurality of thermally conductive rods do not pass through a hole in the printed circuit board.

11. The system of claim 10, wherein the at least one heat sinking element comprises fins.

Assignees

• Commscope Technologies Llc

Inventors

• Lin Philip

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• F28F13/00

  Arrangements for modifying heat-transfer, e.g. increasing, decreasing (F28F1/00 - F28F11/00 take precedence) · CPC title

• F28F2013/005

  Thermal joints · CPC title

• F28F3/022

  the means being wires or pins · CPC title

• H01L23/427 Primary

  Electricity · mapped topic