Stacked microelectronic assemblies with central contacts

Patent metadata

Field	Value
Publication number	US-RE45463-E
Application number	US-201313847269-A
Country	US
Kind code	E1
Filing date	Mar 19, 2013
Priority date	Nov 12, 2003
Publication date	Apr 14, 2015
Grant date	Apr 14, 2015

Abstract

A stacked microelectronic assembly includes a dielectric element and a first and second microelectronic element stacked one on top of the other with the first microelectronic element underlying at least a portion of the second microelectronic element. The first microelectronic element and the second microelectronic element have front surfaces on which exposed on a central region of the front surface are contacts. A spacer layer may be provided under a portion of the second microelectronic element opposite a portion of the second microelectronic element overlying the first microelectronic element. Additionally, a third microelectronic element may be substituted in for the spacer layer so that the first microelectronic element and the third microelectronic element are underlying opposing sides of the second microelectronic element.

First claim

The invention claimed is:

1. A microelectronic assembly comprising:
a dielectric element having an upwardly-facing first surface and a downwardly-facing second surface and having, terminals exposed at said second surface, a first aperture, and a second aperture;
a first microelectronic element overlying said dielectric element, the first microelectronic element having an upwardly-facing rear surface and a downwardly-facing front surface and having contacts exposed at said front…

Assignees

• Tessera Inc

Inventors

• Haba Belgacem

Classifications

• H10W90/754

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W90/732

  Electricity · mapped topic

• H10W90/24

  Electricity · mapped topic

• H10W72/9445

  Electricity · mapped topic