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Blister package

USD1066055S · US · S1

Patent metadata
FieldValue
Publication numberUS-D1066055-S
Application numberUS-202329876094-F
CountryUS
Kind codeS1
Filing dateMay 16, 2023
Priority dateNov 18, 2022
Publication dateMar 11, 2025
Grant dateMar 11, 2025

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CLAIM The ornamental design for a blister package, as shown and described.

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