Barrier assembly

US9997657B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9997657-B2
Application numberUS-201113175495-A
CountryUS
Kind codeB2
Filing dateJul 1, 2011
Priority dateJul 2, 2010
Publication dateJun 12, 2018
Grant dateJun 12, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly comprising: a barrier film, a first polymeric film substrate having a first coefficient of thermal expansion, a pressure sensitive adhesive layer, a second polymeric film substrate having a second coefficient of thermal expansion, wherein the barrier film is disposed between the first polymeric film substrate and the pressure sensitive adhesive layer, wherein the pressure sensitive adhesive layer comprises an acrylic pressure sensitive adhesive, wherein the assembly has an average transmission over the range of 400 nm to 1400 nm of at least 75%, wherein the second coefficient of thermal expansion is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion, wherein the second polymeric film substrate comprises a fluoropolymer, wherein the barrier film comprises at least first and second polymer layers separated by an inorganic barrier layer, and wherein the inorganic barrier layer is immediately adjacent to both the first and second polymer layers, wherein the first polymer layer comprises polymerized volatilizable acrylic or methacrylic monomers, wherein the second polymer layer comprises polymerized volatilizable acrylic or methacrylic monomers, wherein the first polymer layer is in contact with the first polymeric film substrate, wherein the second polymer layer is in direct contact with the acrylic pressure sensitive adhesive layer, and wherein the second polymeric film substrate is in direct contact with the pressure sensitive adhesive layer. 2. The assembly of claim 1 , wherein a ratio of the thickness of the first polymeric film to the second polymeric film is at least 5:2. 3. The assembly of claim 1 , wherein the pressure sensitive adhesive layer has a tensile modulus of up to 3.4×10 8 Pascals. 4. The assembly of claim 1 having a curl of up to 7 m −1 . 5. The assembly of claim 1 , wherein the inorganic barrier layer is an oxide layer that shares a siloxane bond with at least one of the first or second polymer layers. 6. The assembly of claim 1 , wherein at least one of the first or second polymer layers comprises silane and acrylate monomer. 7. The assembly of claim 1 , wherein the first polymeric film substrate comprises at least one of polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyaryletherketone, polyarylate, polyetherimide, polyarylsulfone, polyethersulfone, polyamideimide, or polyimide, any of which may optionally be heat-stabilized. 8. The assembly of claim 1 , wherein a ratio of a tensile modulus of the first polymeric film substrate to a tensile modulus of the second polymeric film substrate is at least 2 to 1. 9. The assembly of claim 6 , wherein the silane is an amino silane represented by formula Z 2 N-L-SiY x Y′ 3-x , wherein each Z is independently hydrogen or alkyl having up to 12 carbon atoms, L is alkylene having up to 12 carbon atoms, Y is alkoxy having up to 12 carbon atoms or halogen, Y′ is alkyl having up to 12 carbon atoms, and x is at least 1.

Assignees

Inventors

Classifications

  • Optical elements · CPC title

  • comprising polysulphones; polysulfides · CPC title

  • Photovoltaic [PV] energy · CPC title

  • comprising halogenated polyolefins, e.g. PTFE · CPC title

  • including components having same physical characteristic in differing degree · CPC title

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What does patent US9997657B2 cover?
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the…
Who is the assignee on this patent?
Weigel Mark D, Roehrig Mark A, Nachtigal Alan K, and 3 more
What technology area does this patent fall under?
Primary CPC classification B32B27/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).