Electrode connecting structure including adhesion layer and electronic device including the same

Patent metadata

Field	Value
Publication number	US-9997604-B2
Application number	US-201515113079-A
Country	US
Kind code	B2
Filing date	Jan 20, 2015
Priority date	Jan 21, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

Provided are an electrode connecting structure that includes an adhesion layer formed between a graphene layer and a metal layer and an electronic device having the electrode connecting structure. The electrode connecting structure may include an adhesion layer formed of a two-dimensional material provided between the graphene layer and the metal layer. The graphene layer may be a diffusion barrier, and the adhesion layer may stably maintain the interface characteristics of the graphene layer and the metal layer when the metal layer is formed on a surface of the graphene layer.

First claim

The invention claimed is:

1. An electrode connecting structure comprising:
an insulating layer defining an opening, the opening having a width defined based on a space between a first sidewall of the insulating layer and a second sidewall of the insulating layer;
a graphene layer in the opening, the graphene layer extending along the first sidewall of the insulating layer in the opening, the graphene layer extending along the second sidewall of the insulating layer in the opening;
an adhesion layer in the opening, the adhesion layer extending along the graphene layer in the opening, the adhesion layer including a two-dimensional material; and
a metal layer in the opening, the metal layer arranged so the graphene layer and the adhesion layer are between the metal layer and the first sidewall of the insulating layer in the opening, the metal layer arranged so the graphene layer and the adhesion layer are between the metal layer and the second sidewall of the insulating layer in the opening.

2. The electrode connecting structure of claim 1 , further comprising:
a lower structure, wherein
the opening of the insulating layer exposes the lower structure, and
the metal layer is electrically connected to the lower structure through the opening.

3. The electrode of claim 2 , wherein
the graphene layer defines a hole that exposes a top surface of the lower structure, and
the metal layer is directly connected to the top surface of the lower structure through the hole of the graphene layer.

4. The electrode connecting structure of claim 1 , wherein the adhesion layer comprises BN.

5. The electrode connecting structure of claim 1 , further comprising:
a lower structure, wherein
the insulating layer is on the lower structure, and
the lower structure is a silicon layer.

6. An electronic device comprising the electrode connecting structure of claim 1 .

7. The electronic device of claim 6 , wherein the electronic device is a transistor, and the transistor is a field effect transistor (FET), a thin film transistor (TFT), a binary junction transistor (BJT), or a barrier transistor.

8. The electronic device of claim 6 , wherein the electronic device is a diode, a solar cell, a photodetector, a tunneling device, a memory device, a logic device, a light-emitting device, an energy storage device, or a display device.

9. The electrode connecting structure of claim 1 , wherein
a portion of the metal layer is on top of the graphene layer.

10. The electrode connecting structure of claim 1 , wherein
a portion of the metal layer is on top of the adhesion layer.

11. The electrode connecting structure of claim 1 , further comprising:
a lower structure, wherein
the insulating layer is on the lower structure,
the opening of the insulating layer exposes the lower structure, and
the adhesion layer extends in a vertical direction relative to a top surface of the lower structure.

12. The electrode connecting structure of claim 1 , further comprising:
a lower structure, wherein
the insulating layer is on the lower structure,
the opening of the insulating layer exposed the lower structure, and
the graphene layer extends in a vertical direction relative to a top surface of the lower structure.

13. The electrode connecting structure of claim 1 , wherein
the graphene layer surrounds the adhesion layer in the opening, and
the adhesion layer surrounds the metal layer in the opening.

14. The electrode of claim 1 , wherein the adhesion layer includes metal chalcogenide based material.

15. An electrode connecting structure comprising:
an insulating layer;
a graphene layer formed on the insulating layer;
an adhesion layer formed on the graphene layer; and
a metal layer formed on the adhesion layer, wherein
the adhesion layer comprises a metal chalcogenide based material.

16. The electrode connecting structure of claim 15 , wherein the metal chalcogenide based material comprises transition metal dichalcogenide (TMDC).

17. The electrode connecting structure of claim 15 , wherein the metal chalcogenide based material comprises at least one metal element selected from the group consisting of Mo, W, Nb, V, Ta, Ti, Zr, Hf, Tc, Re, Cu, Ga, In, Sn, Ge, and Pb and at least one chalcogen element selected from the group consisting of S, Se, and Te.

18. An electronic device comprising:
a substrate, a source and a drain that are formed on the substrate, a gate insulating layer and a gate electrode that are formed on the substrate between the source and the drain;
an insulating layer that is formed on the source and the drain and comprises openings that respectively expose the source and the drain;
a graphene layer and an adhesion layer that are formed on sidewalls of the openings; and
a source electrode and a drain electrode that are formed in the adhesion layer and are respectively electrically connected to the source and the drain.

19. The electronic device of claim 18 , wherein the adhesion layer comprises at least one metal element selected from the group consisting of Mo, W, Nb, V, Ta, Ti, Zr, Hf, Tc, Re, Cu, Ga, In, Sn, Ge, and Pb and at least one chalcogen element selected from the group consisting of S, Se, and Te.

20. The electronic device of claim 18 , wherein the adhesion layer comprises BN.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jaeho
• Lee Changseok
• Park Seongjun

Classifications

• A47G1/08 Primary

  adjustable {(A47G1/0644 takes precedence)} · CPC title

• H10W20/42

  Vias, e.g. via plugs · CPC title

• H10W20/40

  Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes · CPC title

• H10W20/4462

  Carbon or carbon-containing materials, e.g. graphene · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title