Component arrangement determination method

Patent metadata

Field	Value
Publication number	US-9997502-B2
Application number	US-201514799766-A
Country	US
Kind code	B2
Filing date	Jul 15, 2015
Priority date	Aug 18, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

There is provided a component arrangement determination method, in a component mounting apparatus including a plurality of component supply units for supplying components, for determining arrangement of the component supply units used for production of a plurality of types of component mounted boards. The method includes specifying a production frequency of each of the plurality of types of component mounted boards for a predetermined period of time, grouping the plurality of types of component mounted boards into a plurality of groups capable of being produced without changing the arrangement of the component supply units based on the production frequency, and determining arrangement, in the component mounting apparatus, of the component supply units for supplying components necessary for production of types of component mounted boards that belong to each group of the plurality of groups.

First claim

What is claimed is:

1. A component arrangement determination method, in a component mounting apparatus including a plurality of component supply units for supplying components, for determining arrangement of the component supply units used for production of a plurality of types of component mounted boards, the method comprising:
specifying a production frequency of each of the plurality of types of component mounted boards for a predetermined period of time;
grouping the plurality of types of component mounted boards into a plurality of groups capable of being produced without changing the arrangement of the component supply units based on the production frequency;
determining arrangement, in the component mounting apparatus, of the component supply units for supplying components necessary for production of types of component mounted boards that belong to each group of the plurality of groups; and
producing a plurality of types of component mounted boards based on the grouping;
wherein the step of grouping comprises:
classifying the plurality of types of component mounted boards into a plurality of classes according to grades of the production frequency;
selecting one of the plurality of classes;
making a provisional group coupling two types of component mounted boards having a largest number of shared components included in the selected class;
repeating the step of making the provisional group until all of the plurality of types of component mounted boards are coupled; and
determining whether the arrangement of the component supply units is performed in the provisional group,
wherein in the selecting step, the selecting is performed in order from a class with a highest production frequency.

2. The component arrangement determination method according to claim 1 , wherein in the grouping, types of component mounted boards having a high production frequency is preferentially incorporated into one group.

3. The component arrangement determination method according to claim 1 , wherein the production frequency is a ratio of a number of times of production of a relevant type of component mounted board with respect to a total number of times of production of all types of component mounted boards.

4. The component arrangement determination method according to claim 1 , wherein the production frequency is a ratio of a number of production days of a relevant type of component mounted board with respect to a total number of production days.

5. The component arrangement determination method according to claim 1 , wherein in the specifying of the production frequency, the production frequency is specified based on a production history or a production plan, or based on both the production history and the production plan.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Sagara Hiroki
• Yamazaki Takuya
• Takehara Hirokazu
• Iwata Isato

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• G05B2219/36195

  Assembly, mount of electronic parts onto board · CPC title

• G05B19/41805 Primary

  characterised by assembly · CPC title

• H05K13/085

  Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level · CPC title

• Y02P90/20

  Cross-Sectional Technologies · mapped topic