Anisotropic conductive film including oblique region having lower curing ratio

Patent metadata

Field	Value
Publication number	US-9997486-B2
Application number	US-201515115827-A
Country	US
Kind code	B2
Filing date	Feb 3, 2015
Priority date	Feb 4, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

An anisotropic conductive film has a first connection layer and a second connection layer formed on surface of the first connection layer. The first connection layer is a photopolymerized resin layer, and the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of first connection layer on the side of second connection layer, conductive particles for anisotropic conductive connection are arranged in a single layer. A region in which the curing ratio is lower than that of the surface of the first connection layer exists in a direction oblique to the thickness direction of the first connection layer. Alternatively, the curing ratio of a region relatively near another surface of the first connection layer among regions of the first connection layer in the vicinity of the conductive particles is lower than that of the surface of the first connection layer.

First claim

The invention claimed is:

1. An anisotropic conductive film comprising a first connection layer and a second connection layer formed on a surface of the first connection layer, wherein
the first connection layer is a photopolymerized resin layer,
the second connection layer is a thermo- or photo-cationically, anionically, or radically polymerizable resin layer, and
conductive particles for anisotropic conductive connection are arranged in a single layer on the surface of the first connection layer, wherein
the first connection layer includes an oblique region in which a curing ratio is lower than that of the surface of the first connection layer and exists in a direction oblique to a thickness direction of the first connection layer, and a second region having an interface with the oblique region,
the interface is oblique to the surface of the first connection layer, and
the curing ratio of the oblique region is made lower than the second region.

2. The anisotropic conductive film according to claim 1 , wherein the first connection layer is a photo-radically polymerized resin layer obtained by photo-radically polymerizing a photo-radically polymerizable resin layer containing an acrylate compound and a photo-radical polymerization initiator.

3. The anisotropic conductive film according to claim 2 , wherein the first connection layer further contains an epoxy compound and a thermo- or photo-cationic or anionic polymerization initiator.

4. The anisotropic conductive film according to claim 1 , wherein the second connection layer is a thermo- or photo-cationically or anionically polymerizable resin layer containing an epoxy compound and a thermo- or photo-cationic or anionic polymerization initiator or a thermo- or photo-radically polymerizable resin layer containing an acrylate compound and a thermo- or photo-radical polymerization initiator.

5. The anisotropic conductive film according to claim 4 , wherein the second connection layer is a thermo- or photo-cationically or anionically polymerizable resin layer containing an epoxy compound and a thermo- or photo-cationic or anionic polymerization initiator and further contains an acrylate compound and a thermo- or photo-radical polymerization initiator.

6. The anisotropic conductive film according to claim 1 , wherein the conductive particles extend into the second connection layer.

7. The anisotropic conductive film according to claim 1 , wherein a lowest melt viscosity of the first connection layer is higher than a lowest melt viscosity of the second connection layer.

8. A production method of the anisotropic conductive film according to claim 1 , comprising the following steps (A) to (C):
Step (A) a step of arranging conductive particles in a single layer on a photopolymerizable resin layer;
Step (B) a step of irradiating the photopolymerizable resin layer having the arranged conductive particles with inclined ultraviolet light to cause a photopolymerization reaction, to thereby form the first connection layer in which the conductive particles are fixed in a surface thereof; and
Step (C) a step of forming the second connection layer that includes a thermo- or photo-cationically or anionically polymerizable resin layer, or a thermo- or photo-radically polymerizable resin layer on the surface of the first connection layer on a side of the conductive particles.

9. The production method according to claim 8 , wherein the step (B) of irradiating with ultraviolet light is performed from the surface where the conductive particles are arranged in the photopolymerizable resin layer.

10. A production method of the anisotropic conductive film according to claim 1 , comprising the following steps (AA) to (DD):
Step (AA) a step of arranging conductive particles in a single layer on a photopolymerizable resin layer;
Step (BB) a step of irradiating the photopolymerizable resin layer having the arranged conductive particles with inclined ultraviolet light to cause a photopolymerization reaction, to thereby form a first temporary connection layer in which the conductive particles are temporarily fixed on a surface thereof;
Step (CC) a step of forming the second connection layer that includes a thermo-cationically, anionically, or radically polymerizable resin layer on the surface of the first temporary connection layer on a side of the conductive particles; and
Step (DD) a step of irradiating the first temporary connection layer with ultraviolet light from a side opposite to the second connection layer to cause a photopolymerization reaction, to thereby cure the first temporary connection layer to form the first connection layer.

11. The production method according to claim 10 , wherein the step (BB) of irradiating with ultraviolet light is performed from the surface where the conductive particles are arranged in the photopolymerizable resin layer.

12. The production method according to claim 8 , comprising, after the step (C), the following step (Z):
Step (Z) a step of forming a third connection layer that includes a thermo- or photo-cationically, anionically, or radically polymerizable resin layer on a surface of the first connection layer opposite to the conductive particles.

13. The production method according to claim 8 , comprising, before the step (A), the following step (a):
Step (a) a step of forming a third connection layer that includes a thermo- or photo-cationically, anionically, or radically polymerizable resin layer on a surface of the photopolymerizable resin layer, and wherein
in the step (A), the conductive particles are arranged in a single layer on another surface of the photopolymerizable resin layer.

14. The production method according to claim 10 , comprising, after the step (DD), the following step (Z):
Step (Z)
a step of forming a third connection layer that includes a thermo- or photo-cationically, anionically, or radically polymerizable resin layer on a surface of the first connection layer opposite to the conductive particles.

15. The production method according to claim 10 , comprising, before the step (AA), the following step (a):
Step (a)
a step of forming a third connection layer that includes a thermo- or photo-cationically, anionically, or radically polymerizable resin layer on a surface of the photopolymerizable resin layer, and wherein
in the step (AA), the conductive particles are arranged in a single layer on another surface of the photopolymerizable resin layer.

16. A connection structure in which a first electronic component and a second electronic component are connected by anisotropic conduction through the anisotropic conductive film according to claim 1 .

Assignees

• Dexerials Corp

Inventors

• Akutsu Yasushi
• Tsukao Reiji

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07332

  Compression bonding, e.g. thermocompression bonding · CPC title