LED unit and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9997375-B2
Application number	US-201514706292-A
Country	US
Kind code	B2
Filing date	May 7, 2015
Priority date	May 9, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

An LED unit according to the invention has a resin housing which is detachably assembled to a vehicle lamp, a lead frame which has a terminal portion which is connected to an exterior terminal, an LED mounting portion and a control part mounting portion and lead frame which is provided integrally on the housing, an LED which is mounted on the LED mounting portion, and a control part which is mounted on the control part mounting portion for controlling the illumination of the LED. The lead frame has a support resin which is a resin material which holds the LED mounting portion in such a way as to surround the LED mounting portion. The lead frame is bent to a back side of the LED at areas outside the support resin, and the control part mounting portion and the terminal portion are formed respectively by the bent portions.

First claim

The invention claimed is:

1. A manufacturing method of an LED unit which is made by assembling an LED and a control part configured to control the illumination of the LED integrally on a housing made of resin, comprising:
forming a lead frame having a first surface and a second surface opposite to the first surface and comprising:
a terminal forming area comprising a terminal portion configured to connect with an exterior terminal;
an LED mounting area where the LED is mounted on the first surface of the lead frame; and
a control part mounting area where a control part is to be mounted, the terminal forming area, the LED mounting area and the control part mounting area integrally connected to one another;

placing a support resin on the first surface of lead frame to surround the LED mounting area, the support resin being a resin material, the support resin including a groove, the groove exposing the LED mounting area surrounded by the support resin;
mounting the LED on the LED mounting area;
mounting the control part on the control part mounting area;
bending the lead frame to a back side thereof at areas outside the support resin;
assembling the bent lead frame to the housing; and
filling a transparent sealing resin inwards in the groove of the support resin to cover the LED and lead wires after the mounting the LED,
wherein the mounting the LED is performed after covering at least a portion of the LED mounting area,
wherein the control part mounting area comprises a first control part mounting area and a second control part mounting area, the LED mounting area provided between the first and the second control part mounting areas along a length-wise direction of the lead frame,
wherein the bending comprises bending the first control part mounting area and the second control part mounting area with respect to the LED mounting area, and
wherein the first and the second control part mounting areas extending in a direction parallel with each other.

2. The LED unit manufacturing method according to claim 1 , wherein
the mounting the control part comprises:
mounting a metal paste on the control part mounting area;
mounting the control part on the metal paste; and
melting the metal paste to join the mounted control part to the control part mounting area.

3. The LED unit manufacturing method according to claim 1 , wherein in the assembling, the bent lead frame and the housing are formed integrally by an insert molding, the housing made with a resin material.

4. The LED unit manufacturing method according to claim 1 , wherein in the placing the support resin, the lead frame and the support resin are formed integrally by an insert molding of the resin material onto the lead frame.

5. The LED unit manufacturing method according to claim 1 , wherein the support resin surrounds the first surface of the lead frame in a thickness direction of the lead frame.

6. The LED unit manufacturing method according to claim 1 , wherein a width of the control part mounting area is greater than a width of the LED mounting area.

7. The LED unit manufacturing method according to claim 1 , wherein the mounting the control part is performed before the mounting the LED.

8. The LED unit manufacturing method according to claim 1 , wherein in the placing, the support resin is placed on the first and second surfaces of the lead frame.

9. An LED unit which functions as a light source of a vehicle lamp, comprising:
a resin housing detachably assembled to a vehicle lamp;
a lead frame having a first surface and a second surface opposite to the first surface and comprising:
a terminal portion connected to an exterior terminal;
an LED mounting portion;
a control part mounting portion and which is provided integrally on the housing; and
a support resin provided on the first surface of the lead frame to surround the LED mounting portion, the support resin made with a resin material and including a groove, the groove exposing the LED mounting portion surrounded by the support resin;

an LED mounted on the first surface of the lead frame at the LED mounting portion; and
a control part mounted on the control part mounting portion and configured to control the illumination of the LED; and
a transparent sealing resin configured to be filled inwards of the groove of the support resin, the transparent sealing resin covering the LED and lead wires,
wherein the lead frame further comprises bent portions bent to a back side of the LED at areas outside the support resin,
wherein the control part mounting portion and the terminal portion correspond to the bent portions,
wherein the control part mounting portion comprises a first control part mounting portion and a second control part mounting portion, the LED mounting portion provided between the first and the second control part mounting portions along a length-wise direction of the lead frame;
wherein the first and the second control part mounting portions are bent with respect to the LED mounting portion, and
wherein the first and the second control part mounting portions extending in a direction parallel with each other.

10. The LED unit according to claim 9 , wherein the support resin surrounds the first surface of the lead frame in a thickness direction of the lead frame.

11. The LED unit according to claim 9 , wherein a width of the control part mounting portion is greater than a width of the LED mounting portion.

12. The LED unit according to claim 9 , wherein the support resin is placed on the first and second surfaces of the lead frame.

Assignees

• Koito Mfg Co Ltd

Inventors

• Serita Takuya
• Ozawa Atsushi

Classifications

• F21S45/48

  with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title