Method and apparatus for producing an electronic device

Patent metadata

Field	Value
Publication number	US-9996788-B2
Application number	US-201514825986-A
Country	US
Kind code	B2
Filing date	Aug 13, 2015
Priority date	Aug 13, 2014
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.

First claim

What is claimed is:

1. A method of producing an electronic device, comprising the steps of:
applying an adhesive material in a first pattern on a surface of a first substrate;
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material;
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate;
applying a further adhesive material in a second pattern on top of the transferred metal foil;
forming a via from a top surface of the further adhesive material to the transferred metal foil; and
depositing a metallic material on top of the second pattern;
wherein the metallic material is conductively coupled to a portion of the transferred metal foil.

2. The method of claim 1 , wherein the step of applying the further adhesive material includes the step of applying the further adhesive material such that no portion of the second pattern of the further adhesive material extends beyond the first pattern of adhesive material.

3. The method of claim 1 , wherein the transferred metal foil and the metallic material are conductively coupled through the via.

4. The method of claim 1 , further including the step of applying a non-conductive material between the further adhesive material and the transferred metal foil.

5. The method of claim 4 , wherein the non-conductive material has a thickness between 200 Angstroms and 10,000 Angstroms.

6. The method of claim 4 , further including the steps of forming a first via from a top surface of the further adhesive material to a top surface of the non-conductive material, and forming a second via from a top surface of the non-conductive material to a top surface of the transferred metal foil, wherein first via and the second via combine to couple the top surface of the further adhesive material with the top surface of the metal foil.

7. The method of claim 6 , wherein a diameter of the first via is substantially different than a diameter of the second via.

8. The method of claim 1 , wherein the first pattern of the adhesive material has a thickness between 200 and 10,000 Angstroms.

9. The method of claim 1 , wherein activating the adhesive includes activating the adhesive while the portion of the metal foil is in contact with the adhesive material.

10. The method of claim 1 , wherein activating the adhesive includes applying energy to activate the adhesive.

11. The method of claim 10 , wherein the energy includes at least one of mechanical pressure and heat.

12. A method of producing an electronic device, comprising the steps of:
jetting an adhesive material in a first pattern on a surface of a first substrate;
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material;
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate;
applying a further adhesive material in a second pattern on top of the transferred metal foil;
depositing a metallic material on top of the second pattern; and
forming a via from a top surface of the further adhesive material to the transferred metal foil;
wherein the metallic material is conductively coupled to a portion of the transferred metal foil.

Assignees

• Donnelley & Sons Co

Inventors

• Cyman Jr Theodore F
• Murzynowski Alan R
• Kanfoush Daniel E

Classifications

• H05K2203/0522

  Using an adhesive pattern · CPC title

• H05K2203/1545

  Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path · CPC title

• G06K19/077 Primary

  Constructional details, e.g. mounting of circuits in the carrier · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title

• H05K3/046 Primary

  by selective transfer or selective detachment of a conductive layer · CPC title