Downhole thermal component temperature management system and method

US9995131B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9995131-B2
Application numberUS-200913121087-A
CountryUS
Kind codeB2
Filing dateNov 13, 2009
Priority dateNov 13, 2008
Publication dateJun 12, 2018
Grant dateJun 12, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for temperature management of a downhole thermal component includes a heat exchanger thermally coupled with the thermal component and a heat exhausting temperature management system thermally coupled with the thermal component and the heat exchanger to transfer heat from the thermal component to the heat exchanger. The system may include an electrical device coupled between the thermal component and the heat exchanger and a power source to provide an energy flow to the electrical device to transfer heat from the thermal component to the heat exchanger. The system may include a thermoelectric cooler coupled between the thermal component and the heat exchanger. A method includes energizing an electrical device or a thermoelectric cooler to transfer heat from the thermal component to the heat exchanger.

First claim

Opening claim text (preview).

What is claimed is: 1. A system for temperature management of a downhole thermal component, comprising: a heat exchanger comprising: a first axial end; a second axial end opposite the first axial end; and an exterior radial surface extending between the first and second axial ends, wherein an axis of the heat exchanger extends through the first and second axial ends; a first port positioned in the heat exchanger and extending out to the exterior radial surface, the first port connected to an eccentrically positioned inner passageway running axially the length of the heat exchanger; a thermal component positioned inside the first port; and a heat transfer device positioned between the heat exchanger and the thermal component to thereby transfer heat from the thermal component to the heat exchanger; a second port extending along the axis of the heat exchanger and connected to the eccentrically positioned inner passageway, the second port in connection with an interior chamber of the heat exchanger extending from an end of the second port to the second axial end. 2. A system as defined in claim 1 , wherein the thermal component is secured in the first port by a cap. 3. A system as defined in claim 2 , further comprising an insulation mount coupled between the cap and the heat exchanger. 4. A system as defined in claim 3 , wherein the insulation mount is configured to restrict heat transfer. 5. A system as defined in claim 1 , wherein at least one of the first and second ends of the heat exchanger are coupled to a drill string or wireline assembly. 6. A system as defined in claim 1 , wherein the heat transfer device is a thermoelectric cooler. 7. A downhole system for temperature management of a thermal component, comprising: a first heat exchanger component having an outer cylindrical first heat transfer surface defining an axis extending through a first axial end and a second axial end; a first port formed within said first heat exchanger component, the first port extending to an exterior radial surface of said first heat exchanger component and defining a generally planar second heat transfer surface of said first heat exchanger component; a first chassis carrying a first thermal component; a first thermoelectric cooler having a first semiconductor and a second semiconductor made of dissimilar materials carried by said first chassis and thermally coupled between said first thermal component and said second heat transfer surface; and a second port formed and extending within said first heat exchanger component and defining a generally planar third heat transfer surface of said first heat exchanger component; wherein said second port is connected to an eccentrically positioned inner passageway running axially the length of said first heat exchanger component and is in connection with an interior chamber of the first heat exchanger component extending from an end of the second port to the second axial end of the first heat exchanger component. 8. A system as defined in claim 7 , further comprising: a second chassis carrying a second thermal component; and a second thermoelectric cooler carried by said second chassis and thermally coupled between said second thermal component and said third heat transfer surface of said first heat exchanger component. 9. A system as defined in claim 8 , further comprising: said first chassis is received within said first port; and said second chassis is received within said second port. 10. A system as defined in claim 8 , wherein: said first port is radially formed within said first heat exchanger component and defines said generally planar second heat transfer surface oriented parallel to said axis; and said second port is longitudinally formed within said first heat exchanger component and defines said generally planar third heat transfer surface oriented normal to said axis. 11. A system as defined in claim 7 , further comprising: said first chassis is received within said first port. 12. A system as defined in claim 7 , wherein the first heat exchanger component is coupled to a drill string or wireline assembly. 13. A system as defined in claim 7 , wherein: said first port is radially formed within said first heat exchanger component and defines said generally planar second heat transfer surface oriented parallel to said axis. 14. A system as defined in claim 7 , wherein: said first chassis includes a cap that seals said first thermal component and said first thermoelectric cooler within said first port from the outer cylindrical first heat transfer surface.

Assignees

Inventors

Classifications

  • E21B47/017Primary

    Protecting measuring instruments · CPC title

  • E21B47/011Primary

    Fixed Constructions · mapped topic

  • Cooling arrangements · CPC title

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Frequently asked questions

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What does patent US9995131B2 cover?
A system for temperature management of a downhole thermal component includes a heat exchanger thermally coupled with the thermal component and a heat exhausting temperature management system thermally coupled with the thermal component and the heat exchanger to transfer heat from the thermal component to the heat exchanger. The system may include an electrical device coupled between the thermal…
Who is the assignee on this patent?
Herrera Adan Hernandez, Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification E21B47/017. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).