Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same

US9994681B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9994681-B2
Application numberUS-201715647648-A
CountryUS
Kind codeB2
Filing dateJul 12, 2017
Priority dateJan 13, 2015
Publication dateJun 12, 2018
Grant dateJun 12, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

First claim

Opening claim text (preview).

What is claimed is: 1. A curable organopolysiloxane composition, comprising: (a) an organopolysiloxane prepolymer being a reaction product of reactants comprising: (1) a cyclic isocyanurate having two or more ethylenically unsaturated double bonds which is represented by formula (1) wherein R 1 , R 2 and R 3 independently from each other represent an alkyl group having from 1 to 20 carbon atoms, an aromatic group having from 6 to 20 carbon atoms, a monovalent organic group represented by —(CH 2 ) m —X or —(CH 2 ) p —O—(CH 2 ) q —Y, in which m is from 0 to 3, p is from 0 to 3, q is from 0 to 3, X and Y are selected from the group consisting of an alkenyl group having from 2 to 20 carbon atoms, an epoxy group having from 2 to 20 carbon atoms, and a trialkoxysilyl group having from 1 to 20 carbon atoms independently for each alkoxy group; and at least two of R 1 , R 2 and R 3 contain an ethylenically unsaturated double bond, (2) a linear organohydroqensiloxane having at least one hydrogen atom directly bonded to a silicon atom in one molecule, represented by the average compositional formula (2): R 4 R 5 R 6 SiO 1/2 ) a (R 7 R 8 SiO 2/2 ) b   (2), wherein at least one of R 4 to R 8 is a hydrogen atom directly bonded to a silicon atom, at least one of R 4 to R 8 is an aromatic group having from 6 to 20 carbon atoms, the others of R 4 to R 8 independently from each other represent an alkyl group having from 1 to 20 carbon atoms or an alkoxy group having from 1 to 20 carbon atoms, a is from 0.1 to 0.9, b is from 0.1 to 0.9, and the sum of a+b is 1; and (3) an hydrosilylation catalyst (I), wherein the molar ratio of the ethylenically unsaturated double bonds contained in component (a) to the hydrogen atom directly bonded to a silicon atom contained in component (b) is from 2.2 to 5.0, (b) an organopolysiloxane comprising at least two ethylenically unsaturated double bonds in one molecule represented by the average compositional formula (3): (R 9 R 10 R 11 SiO 1/2 ) c (R 12 SiO 3/2 ) d (SiO 4/2 ) e   (3) wherein at least one of R 9 to R 12 is an alkenyl group having from 2 to 20 carbon atoms, at least one of R 9 to R 12 is an aromatic group having from 6 to 20 carbon atoms, the others of R 9 to R 12 independently from each other represent an alkyl group having from 1 to 20 carbon atoms or an alkoxy group having from 1 to 20 carbon atoms, from 15 to 65 mol % of R 9 to R 12 in one molecule of the organopolysiloxane are an aromatic group having from 6 to 20 carbon atoms, from 1 to 50 mol % of R 9 to R 12 in one molecule of the organopolysiloxane are an alkenyl group having from 2 to 20 carbon atoms, and the total mol % of R 9 to R 12 in one molecule of the organopolysiloxane is 100 mol %, c is from 0.1 to 0.8, d is from 0.2 to 0.9, e is from 0 to 0.2, and the sum of c+d+e is 1, (c) a branched polyorganohydrogensiloxane having 1 to 3 hydrogen atoms directly bonded to a silicon atom in one molecule represented by the average compositional formula (4): (R 13 R 14 R 15 SiO 1/2 ) f (R 16 SiO 3/2 ) g (SiO 4/2 ) h   (4) wherein at least one of R 13 to R 16 is a hydrogen atom directly bonded to a silicon atom, at least one of R 13 to R 16 is an aromatic group having from 6 to 20 carbon atoms, the others of R 13 to R 16 independently from each other represent an alkyl group having from 1 to 20 carbon atoms or an alkoxy group having from 1 to 20 carbon atoms, f is from 0.1 to 0.8, g is from 0.2 to 0.9, h is from 0 to 0.5, and the sum of f+g+h is 1; (d) a linear organohydrogensiloxane having at least one hydrogen atom directly bonded to a silicon atom in one molecule, represented by the average compositional formula (5): (R 17 R 18 R 19 SiO 1/2 ) i (R 20 R 21 SiO 2/2 ) i   (5), wherein at least one of R 17 to R 21 is a hydrogen atom directly bonded to a silicon atom, at least one of R 17 to R 21 is an aromatic group having from 6 to 20 carbon atoms, the others of R 17 to R 21 independently from each other represent an alkyl group having from 1 to 20 carbon atoms or an alkoxy group having from 1 to 20 carbon atoms, i is from 0.1 to 0.9, j is from 0.1 to 0.9, and the sum of i+j is 1, and (e) a hydrosilylation catalyst (II). 2. The curable organopolysiloxane composition according to claim 1 , wherein component (a) is present in an amount of from 5 to 25% by weight of the total weight of all components. 3. The curable organopolysiloxane composition according to claim 1 , wherein from 20 to 50 mol % of R 9 to R 12 in one molecule of component (b) is an aromatic group having from 6 to 20 carbon atoms. 4. The curable organopolysiloxane composition according to claim 1 , wherein from 5 to 30 mol % of R 9 to R 12 in one molecule of component (b) is alkenyl group having from 2 to 20 carbon atoms. 5. The curable organopolysiloxane composition according to claim 1 , wherein component (b) is present in an amount of from 5 to 80% by weight of the total weight of all components. 6. The curable organopolysiloxane composition according to claim 1 , wherein the component (c) is present in an amount of from 1 to 50% by weight of the total weight of all components. 7. The curable organopolysiloxane composition according to claim 1 , wherein in component (d), i is a positive number of from 0.2 to 0.6, j is a positive number of from 0.4 to 0.8, and the sum of i+j is 1. 8. The curable organopolysiloxane composition according to claim 1 , wherein the molar ratio of the hydrogen atom directly bonded to a silicon atom contained in component (d) to the alkenyl group contained in component (b) is from 0.5 to 1.2. 9. The curable organopolysiloxane composition according to claim 1 , wherein the amount of component (d) is from 1 to 40% by weight of the total amount of all components. 10. An optical device comprising the curable organopolysiloxane composition according to claim 1 . 11. A cured product of the curable organopolysiloxane composition according to claim 1 . 12. A light emitting material comprising the cured product according to claim 11 . 13. An optical device comprising the cured product according to claim 11 .

Assignees

Inventors

Classifications

  • Six-membered rings · CPC title

  • containing silicon bound to hydrogen · CPC title

  • C08G77/20Primary

    containing silicon bound to unsaturated aliphatic groups · CPC title

  • characterised by the catalysts used · CPC title

  • characterised by their material, e.g. epoxy or silicone resins · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9994681B2 cover?
The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.
Who is the assignee on this patent?
Henkel Ag & Co Kgaa
What technology area does this patent fall under?
Primary CPC classification C08G77/20. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).