Curable fiberglass binder

US9994482B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9994482-B2
Application numberUS-201013386865-A
CountryUS
Kind codeB2
Filing dateAug 6, 2010
Priority dateAug 11, 2009
Publication dateJun 12, 2018
Grant dateJun 12, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.

First claim

Opening claim text (preview).

That which is claimed is: 1. A curable composition for use in the binding of fiberglass comprising: an aldehyde or ketone; an amino-amide which is a conjugate addition product of an amine and a reactant; and a thickener, wherein: the amine comprises 1,6-hexanediamine, the reactant comprises maleic anhydride, the aldehyde or ketone comprises a reducing sugar, the amino-amide is oligomerized by heating at a temperature from 120° C. to 150° C. prior to adding the aldehyde or ketone to the amino-amide, and the curable composition is formaldehyde-free. 2. The curable composition of claim 1 , wherein the thickener is based on polysaccharides. 3. The curable composition of claim 1 , wherein the thickener has a weight average molecular weight of at least about 100,000 and below about 2,000,000. 4. The curable composition of claim 1 , wherein the thickener is based on hydroxyalkyl cellulose or carboxyalkyl cellulose. 5. The curable composition of claim 1 , wherein the thickener is present in the curable composition from 0.05 to 0.7 weight percent (based on dry mass). 6. The curable composition of claim 1 , wherein the composition comprises carbon black. 7. The curable composition of claim 1 , wherein the carbon black is present in the curable compositions from 10 to 50 weight percent (based on dry mass). 8. The curable composition of claim 6 , wherein the carbon black has particle size of 70 nm or less. 9. The curable composition of claim 1 , wherein an aldehyde is used with the amino-amide. 10. The curable composition of claim 1 , wherein the amino-amide is an oligomer. 11. The curable composition of claim 1 , wherein: the amino-amide comprises an amide group and a carboxylic acid group, and the amide group and the carboxylic acid group are formed by an amine group of the 1,6-hexanediamine covalently bonding with a carbonyl group of the maleic anhydride. 12. The curable composition of claim 1 , wherein the amino-amide is a monomer, dimer, trimer, or tetramer. 13. The curable composition of claim 1 , wherein the amino-amide comprises an amic acid function.

Assignees

Inventors

Classifications

  • characterised by the bonding agents used · CPC title

  • Glass fibres · CPC title

  • Starch derivatives {, e.g. crosslinked derivatives} · CPC title

  • Coated or impregnated glass fiber fabric · CPC title

  • with hydroxylated hydrocarbon radicals · CPC title

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What does patent US9994482B2 cover?
A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits goo…
Who is the assignee on this patent?
Eckert Bernhard, Christensen Bernd, Shooshtari Kiarash Alavi, and 4 more
What technology area does this patent fall under?
Primary CPC classification C03C25/321. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).