Semiconductor device and method for manufacturing same
US-2015129865-A1 · May 14, 2015 · US
US9989828B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9989828-B2 |
| Application number | US-201515504963-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 17, 2015 |
| Priority date | Aug 20, 2014 |
| Publication date | Jun 5, 2018 |
| Grant date | Jun 5, 2018 |
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A semiconductor device includes: a first substrate; a gate electrode on the first substrate; a gate insulating layer on the gate electrode; an oxide semiconductor film including a channel region disposed over the gate electrode through the gate insulating layer and lowered-resistance region contacting the channel region; a source electrode and a drain electrode on the channel region; a first insulating film covering at least the channel region and including a contact hole that exposes the lowered-resistance region; and a second insulating film having reducing characteristics and disposed above the first insulating film across the contact hole, the second insulating film contacting the lowered-resistance region inside the contact hole.
Opening claim text (preview).
What is claimed is: 1. A semiconductor device, comprising: a first substrate; a gate electrode on the first substrate; a gate insulating layer on the gate electrode; an oxide semiconductor film including a channel region disposed over the gate electrode through the gate insulating layer, and a lowered-resistance region contacting the channel region; a source electrode and a drain electrode on the channel region; a first insulating film covering at least the channel region and including a contact hole that exposes the lowered-resistance region; and a second insulating film having reducing characteristics and disposed above the first insulating film across the contact hole, said second insulating film contacting the lowered-resistance region inside the contact hole, wherein the second insulating film contains hydrogen and wherein a distance between an edge of the contact hole and the source electrode is greater than 1.5 μm. 2. The semiconductor device according to claim 1 , wherein the second insulating film surrounds, in a plan view, the first insulating film that covers the channel region. 3. The semiconductor device according to claim 1 , wherein the oxide semiconductor film contains indium (In), gallium (Ga), zinc (Zn), and oxygen (O). 4. The semiconductor device according to claim 3 , wherein the oxide semiconductor film is a crystalline oxide semiconductor film. 5. A liquid crystal display device, comprising: the semiconductor device according to claim 1 ; a second substrate facing the first substrate of the semiconductor device; and a liquid crystal layer containing liquid crystal molecules and interposed between the first substrate and second substrate, wherein the semiconductor device includes a third conductive film disposed in a location above the second insulating film overlapping at least the lowered-resistance region in a plan view, wherein one of the lowered-resistance region and the third conductive film has a plurality of slit openings having slit-like shapes, said one of the lowered-resistance region and the third conductive film forming a pixel electrode in each pixel, and wherein another of the lowered-resistance region and the third conductive film forms a common electrode that generates an electric field between the common electrode and the pixel electrode to control orientation of the liquid crystal molecules. 6. The semiconductor device according to claim 1 , wherein the drain electrode is formed on a region in the oxide semiconductor film to which the lowered-resistance region extends. 7. The semiconductor device according to claim 1 , wherein a distance between an edge of the contact hole and the drain electrode is smaller than 1.5 μm.
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