Directed energy deposition with cooling mechanism

Patent metadata

Field	Value
Publication number	US-9988718-B2
Application number	US-201615184598-A
Country	US
Kind code	B2
Filing date	Jun 16, 2016
Priority date	Jun 19, 2015
Publication date	Jun 5, 2018
Grant date	Jun 5, 2018

Abstract

A material deposition system and method for cooling a component after material deposition. The method of deposition and cooling comprising a platform, a deposition head, and a cooling mechanism. The platform adapted to support a component for the addition of material. The deposition head including a material depositor configured to deposit material on a surface of a component supported on the platform an and an energy source configured to energize material deposited onto a surface of a component supported on the platform to bond the material to the component. The cooling system including bristles.

First claim

What is claimed is:

1. A material deposition system, the system comprising a platform adapted to support a component for the addition of material,
a deposition head including a material depositor configured to deposit material on a surface of a component supported on the platform and an energy source configured to energize material deposited onto a surface of a component supported on the platform to bond the material to the component, and
a cooling mechanism including a gas source configured to discharge cooling medium toward a component supported on the platform and a plurality of thermally conductive bristles arranged to interact with cooling medium discharged from the gas source toward a component supported on the platform when the gas source discharges cooling medium,
wherein the conductive bristles forms a passageway sized to allow the cooling medium to flow through each of the conductive bristles towards the component.

2. The system of claim 1 , wherein the conductive bristles comprise a conductive material with a conductivity between about 1 W/(m K) and about 450W/(m K) at 25° C.

3. The system of claim 1 , wherein the conductive bristles are arranged to contact the component, to increase heat transfer over cooling medium alone.

4. The system of claim 1 , wherein the conductive bristles are located between the deposition head and the platform.

5. The system of claim 1 , wherein the conductive bristles are coupled to the deposition head for movement with the deposition head.

6. The system of claim 5 , wherein the deposition head and the conductive bristles are mounted for movement relative to the platform.

7. The system of claim 1 , wherein the platform is mounted for movement relative to the deposition head.

8. The system of claim 7 , wherein the platform is mounted for movement relative to the plurality of conductive bristles.

9. The system of claim 1 , wherein the cooling mechanism further comprises purging nozzles configured to discharge a shield gas to inhibit material addition onto the conductive bristles.

10. The system of claim 9 , wherein the purging nozzles are located between some of the plurality of the conductive bristles and the deposition head.

11. A material deposition system, the system comprising a platform adapted to support a component for the addition of material,
a deposition head including a material depositor configured to deposit material on a surface of a component supported on the platform and an energy source configured to energize material deposited onto a surface of a component supported on the platform to bond the material to the component, and
a cooling mechanism including a gas source configured to discharge cooling medium toward a component supported on the platform and a plurality of bristles arranged to interact with cooling medium discharged from the gas source toward a component supported on the platform when the gas source discharges cooling medium,
wherein the cooling mechanism further comprises a shield arranged to inhibit material addition onto the conductive bristles.

12. The system of claim 11 , wherein the shield is between the conductive bristles and the deposition head.

13. A material deposition system, the system comprising a platform,
a deposition head including a material depositor and an energy source, and
a cooling mechanism including a gas source configured to discharge cooling air toward a component supported on the platform and a plurality of bristles arranged to direct the cooling air from the gas source along the bristles toward the component.

14. The system of claim 13 , wherein the cooling mechanism further comprises purging nozzles configured to discharge a shield gas to inhibit material addition onto the bristles.

15. The system of claim 13 , wherein the bristles are conductive bristles and comprise a thermally conductive material with a conductivity between about 1 W/(m K) and about 450 W/(m K) at 25° C.

Assignees

• Rolls Royce Corp

Inventors

• Ma Kong
• Shuck Quinlan Y
• Bader Jacque S

Classifications

• B33Y10/00

  Processes of additive manufacturing · CPC title

• B29C67/0077

  Operations & Transport · mapped topic

• B23K26/144

  the fluid stream containing particles, e.g. powder · CPC title

• C23C16/463 Primary

  Cooling of the substrate · CPC title

• F01D5/005

  Repairing methods or devices · CPC title