Manufacturing method and manufacturing equipment of display device
US-2024414999-A1 · Dec 12, 2024 · US
US9988708B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9988708-B2 |
| Application number | US-201414768500-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2014 |
| Priority date | Feb 19, 2013 |
| Publication date | Jun 5, 2018 |
| Grant date | Jun 5, 2018 |
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Official abstract text for this publication.
A dyeing device dyes a resin body by vaporizing and depositing a sublimation dye adhered to a dyeing base to a resin body and fixing the dye to the resin body. The dyeing device lowers the pressure inside a closed chamber that closes the periphery of the resin body by a pump. In the state where the adhesion surface of the dyeing base to which the dye is adhered faces the resin body without contact, by heating the dye adhered to the dyeing base inside the closed chamber of which the pressure is lowered, the dye is sublimated, vaporized, and deposited on the resin body. The pressure inside the closed chamber is raised higher than the pressure at the vaporizing and depositing time. By irradiating the resin body on which the dye is vaporized and deposited with electromagnetic wave, the resin body is heated and the dye is and fixed.
Opening claim text (preview).
The invention claimed is: 1. A dyeing device for dyeing a resin body by vaporizing and depositing a sublimation dye adhered to a dyeing base to the resin body and fixing the dye to the resin body, comprising: a closed chamber that closes at least a periphery of the resin body provided in an installing unit; a pressure lowering device configured to lower pressure inside the closed chamber; a heating unit configured to heat the dye adhered to the dyeing base and configured to heat the resin body; a processor; and memory storing a program, when executed by the processor, causing the dyeing device to execute: a pressure lowering controlling instruction of lowering the pressure inside the closed chamber by using the pressure lowering device; a vaporization and deposition controlling instruction of vaporizing and depositing the dye on the resin body by heating, by the heating unit, the dye adhered to the dyeing base inside the closed chamber of which pressure is lowered, according to the pressure lowering controlling instruction, to sublimate the dye in a state where an adhesion surface of the dyeing base to which the dye is adhered faces the resin body without contact; and a fixation controlling instruction of fixing the dye by irradiating the resin body on which the dye is vaporized and deposited with electromagnetic wave from the heating unit to heat the deposited dye and the resin body in response to the pressure of the periphery of the resin body rises at the time of fixation is higher than the pressure at a vaporizing and depositing time according to the vaporization and deposition controlling instruction, wherein the heating unit includes an electromagnetic wave generator configured to generate the electromagnetic wave to heat the dye and the resin body. 2. The dyeing device according to claim 1 , wherein a transmitting unit configured to allow the electromagnetic wave to penetrate is provided at least at a part of the closed chamber between the resin body provided in the installing unit and the electromagnetic wave generator. 3. The dyeing device according to claim 1 , further comprising a retracting unit configured to retract the dyeing base from a position heated by the heating unit. 4. The dyeing device according to claim 3 further comprising a retraction driver configured to drive the retracting unit, wherein the fixation controlling instruction causes the heating unit to irradiate the resin body with the electromagnetic wave in the state where the retraction driver is controlled to retract the dyeing base. 5. A dyeing device for dyeing a resin body by vaporizing and depositing a sublimation dye adhered to a dyeing base to the resin body and fixing the dye to the resin body, comprising: a closed chamber that closes at least a periphery of the resin body provided in an installing unit; a pressure lowering device configured to lower pressure inside the closed chamber; a heating unit, including an electromagnetic wage generator, configured to heat the dye adhered to the dyeing base and configured to heat the resin body; a processor; and memory storing a program, when executed by the processor, causing the dyeing device to execute: a pressure lowering controlling instruction of lowering the pressure inside the closed chamber by using the pressure lowering device; a vaporization and deposition controlling instruction of vaporizing and depositing the dye on the resin body by heating, by the heating unit, the dye adhered to the dyeing base inside the closed chamber of which pressure is lowered, according to the pressure lowering controlling instruction, to sublimate the dye in a state where an adhesion surface of the dyeing base to which the dye is adhered faces the resin body without contact; and a fixation controlling instruction of fixing the dye by irradiating the resin body on which the dye is vaporized and deposited with electromagnetic wave from the heating unit to heat the deposited dye and the resin body in response to the pressure of the periphery of the resin body rises higher than the pressure at a vaporizing and depositing time according to the vaporization and deposition controlling instruction, wherein the electromagnetic wave generator includes a central opening. 6. The dyeing device according to claim 5 , wherein the heating unit further includes a distribution adjusting unit, including at least one central opening, configured to adjust an electromagnetic wave generated by the electromagnetic wave generator, and wherein the central opening of the electromagnetic wave generator corresponds to a shape of the central opening of the distribution adjusting unit. 7. The dyeing device according to claim 1 , further comprising a retracting unit configured to retract the dyeing base from a position heated by the heating unit in a direction having a lateral component.
Physical treatments affecting dyeing, e.g. ultrasonic or electric · CPC title
Fugitive dyeing or stripping dyes · CPC title
Optical coatings produced by application to, or surface treatment of, optical elements (G02B1/08 takes precedence) · CPC title
Controlling or regulating the coating process · CPC title
Substrate holders · CPC title
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