Epoxy-resin composition and film, prepreg, and fiber-reinforced plastic using same

Patent metadata

Field	Value
Publication number	US-9988508-B2
Application number	US-201314409249-A
Country	US
Kind code	B2
Filing date	Aug 20, 2013
Priority date	Aug 20, 2012
Publication date	Jun 5, 2018
Grant date	Jun 5, 2018

Abstract

An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.

First claim

What is claimed is:

1. An epoxy-resin composition, comprising components (A), (B), (C), (D) and (E), wherein
component (A) is an epoxy resin comprising an oxazolidone-ring structure;
component (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not comprise an oxazolidone-ring structure;
component (C) is an epoxy resin in a liquid state at 30° C.;
component (D) is a triblock copolymer copolymerized with dimethylacrylamide; and
component (E) is a curing agent;
wherein, the proportion of the dimethylacrylamide in the triblock copolymer copolymerized with dimethylacrylamide is set at 10 to 15 mass % with respect to the total mass of the triblock copolymer copolymerized with dimethylacrylamide,
wherein, with respect to the total mass of epoxy resin in the epoxy-resin composition,
the content of component (A) is set at 3 to 45 mass %,
the content of component (B) is set at 8 to 55 mass %,
the content of component (C) is set at 20 to 60 mass %,
and the total content of components (A), (B) and (C) does not exceed 100 mass %,
wherein the content of component (D) is 5 to 11 parts by mass based on 100 parts by mass of epoxy resin in the epoxy-resin composition, and
the content of component (E) is 1 to 25 parts by mass based on 100 parts by mass of epoxy resin in the epoxy-resin composition.

2. The epoxy-resin composition according to claim 1 , wherein the content of component (A) in the epoxy resin composition is set at 4 to 30 mass % of the total mass of epoxy resin in the epoxy-resin composition.

3. The epoxy-resin composition according to claim 1 , wherein component (D) is a triblock copolymer of poly(methyl methacrylate)/poly(butyl acrylate)/poly(methyl methacrylate).

4. The epoxy-resin composition according to claim 1 , wherein component (E) is dicyandiamide.

5. The epoxy-resin composition according to claim 1 , further comprising component (F), which is a urea-based curing aid.

6. The epoxy-resin composition according to claim 5 , wherein component (F) is 3-phenyl-1,1-dimethylurea or toluene bis dimethyl urea.

7. The epoxy-resin composition according to claim 1 , wherein component (B) is a bisphenol A epoxy resin.

8. The epoxy-resin composition according to claim 1 , wherein component (C) does not comprise an oxazolidone-ring structure and its viscosity at 30° C. is 1000 Pa·s or lower.

9. The epoxy-resin composition according to claim 1 , wherein component (C) is a bisphenol bifunctional epoxy resin.

10. The epoxy-resin composition according to claim 1 , wherein with respect to the total mass of epoxy resin in the epoxy-resin composition,
the content of component (B) is set at 8 to 50 mass %.

11. A film comprising the epoxy-resin composition according to claim 1 .

12. A prepreg made by impregnating a reinforcing fiber material with the epoxy-resin composition according to claim 1 .

13. A fiber-reinforced plastic comprising reinforcing fiber and a cured product of the epoxy-resin composition according to claim 1 .

14. The epoxy-resin composition according to claim 1 , wherein component (E) is dicyandiamide, the content of component (E) in the epoxy-resin composition is set so that the molar number of active hydrogens in dicyandiamide is set at 0.6 to 1.0 times the molar number of the epoxy groups of the epoxy resin in the epoxy-resin composition.

15. The epoxy-resin composition according to claim 1 , wherein with respect to the total mass of epoxy resin in the epoxy-resin composition, the content of component (C) is set at 45 to 50 mass %.

16. The epoxy-resin composition according to claim 1 , wherein the content of component (D) is 5 to 9 parts by mass based on 100 parts by mass of epoxy resin in the epoxy-resin composition.

17. The epoxy-resin composition according to claim 1 , wherein a number-average molecular weight of component (C) is less than 600.

Assignees

• Mitsubishi Rayon Co
• Mitsubishi Chem Corp

Inventors

• Ishimoto Tomoko
• Kaneko Manabu
• Watanabe Kenichi
• Fukuhara Yasuhiro
• KITA Sanae

Classifications

• C08G59/4021

  Ureas; Thioureas; Guanidines; Dicyandiamides · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• D06M15/55

  Epoxy resins · CPC title

• C08J2453/00

  Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title