Ovenable heat-sealed package

US9988198B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9988198-B2
Application numberUS-201113813244-A
CountryUS
Kind codeB2
Filing dateJul 22, 2011
Priority dateAug 23, 2010
Publication dateJun 5, 2018
Grant dateJun 5, 2018

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylene/alkyl(meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers, and ionomers. The second film comprises at least 70%) of one or more polyamides. The package is useful under ovenable conditions.

First claim

Opening claim text (preview).

What is claimed is: 1. A package comprising: a heat seal between a first film and a second film wherein: the first film comprises: at least 70% by weight of the first film of one or more polyamides; and at least one modified interior layer comprising: at least 70% by weight of the modified interior layer of one or more polyamides; and one or more modifiers selected from ethylene/alkyl (meth)acrylate copolymers; and the second film comprises at least 70% by weight of the second film of one or more polyamides and wherein the ethylene/alkyl (meth)acrylate copolymer comprises at least 20% alkyl (meth)acrylate monomer content based on the weight of the copolymer. 2. A package comprising: a heat seal between a first film and a second film wherein: the first film comprises: at least 70% by weight of the first film of one or more polyamides; and at least one modified interior layer comprising: at least 70% by weight of the modified interior layer of one or more polyamides; and one or more modifiers selected from ethylene/alkyl (meth)acrylate copolymers; and the second film comprises at least 70% by weight of the second film of one or more polyamides and wherein the ethylene/alkyl (meth)acrylate copolymer comprises methyl acrylate monomer content of at least 18% based on the weight of the copolymer and the ethylene/alkyl (meth)acrylate copolymer has a melting temperature of at least 92° C.

Assignees

Inventors

Classifications

  • Flexible containers, e.g. bags, pouches, envelopes · CPC title

  • Rigid containers, e.g. trays, bottles, boxes, cups · CPC title

  • the cover being welded or adhered to the container · CPC title

  • Food packaging · CPC title

  • Bags · CPC title

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Frequently asked questions

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What does patent US9988198B2 cover?
A package comprises a heat seal between a first film and a second film. The first film comprises at least 70% of one or more polyamides. The first film also comprises at least one modified layer comprising (1) at least 70% of one or more polyamides and (2) one or more modifiers selected from ethylene/alkyl(meth)acrylate copolymers, ethylene/(meth)acrylic acid copolymers, and ionomers. The secon…
Who is the assignee on this patent?
Brebion Herve, Cryovac Inc
What technology area does this patent fall under?
Primary CPC classification B29C65/18. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 05 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).