Method of packing silicon and packing body

Patent metadata

Field	Value
Publication number	US-9988188-B2
Application number	US-23014108-A
Country	US
Kind code	B2
Filing date	Aug 25, 2008
Priority date	Aug 27, 2007
Publication date	Jun 5, 2018
Grant date	Jun 5, 2018

Abstract

When packing a polycrystalline silicon with a two-layer structured packing body comprising an inner bag ( 1 a ) and an outer bag ( 1 b ), there are used the inner bag ( 1 a ) and the outer bag ( 1 b ) having bottom sections ( 4 a, 4 b ) provided with a pair of tucked sections, the shape of which is substantially a triangle in plan view, formed by inward-folding the portions continued from both of rectangular side face sections ( 3 a, 3 b ), and when storing the inner bag ( 1 a ) that stores the polycrystalline silicon therein into the outer bag ( 1 b ), the bottom sections ( 4 a, 4 b ) are superimposed with the respective tucked sections ( 6 a, 6 b ) of the inner bag ( 1 a ) and the outer bag ( 1 b ) displaced from each other by 90° so that they do not overlap on each other.

First claim

What is claimed is:

1. A multiple-layer packing body for silicon consisting of: a plurality of packing bags consisting of an inner bag and an outer bag, the inner bag being superposed in the outer bag, wherein
each packing bag is made of:
a substantially square bottom section;
a bottom sealed section; and
four side face sections,

each bottom section is made of:
tucked sections each consisting of three sheets each having a substantially isosceles triangle shape in plan view; and
non-tucked sections between the tucked sections each consisting of a sheet each having a substantially isosceles triangle shape in plan view,

the tucked sections of one of the plurality of packing bags and the non-tucked sections of the other packing bag are stacked and constitute an entire bottom section of the packing body with four sheets,
each packing bag has a margin section of an upper end section to form a strip shape by overlapping both opposing side face sections and folding several times,
the strip-shaped folded sections of the respective packing bags are arranged in parallel to the bottom sealed section, and
a top section of the packing body is configured to include:
a first region including the strip-shaped folded section of the inner bag;
a second region including the strip-shaped folded section of the outer bag which longitudinal direction of the strip shape is orthogonally arranged to a longitudinal direction of the strip shape of the strip-shaped folded section of the inner bag; and
a third region where the strip-shaped folded sections of the respective packing bags are overlapped on each other.

2. A method of packing silicon with a multiple-layer packing body using a plurality of packing bags, said method comprising:
providing a multiple-layer packing body for silicon consisting of: a plurality of packing bags consisting of an inner bag and an outer bag, the inner bag being superposed in the outer bag, wherein
each packing bag is made of:
a substantially square bottom section;
a bottom sealed section; and
four side face sections,

each bottom section is made of:
tucked sections each consisting of three sheets each having a substantially isosceles triangle shape in plan view; and
non-tucked sections between the tucked sections each consisting of a sheet each having a substantially isosceles triangle shape in plan view,

where the tucked sections of one of the plurality of packing bags and the non-tucked sections of the other packing bag are stacked and constitute an entire bottom section of the packing body with four sheets,
each packing bag has a margin section of an upper end section to form a plate shape by overlapping both opposing side face sections and folding several times,
the strip-shaped folded sections of the respective packing bags are arranged in parallel to the bottom sealed section, and
a top section of the packing body is configured to include:
a first region including the strip-shaped folded section of the inner bag;
a second region including the strip-shaped folded section of the outer bag; and
a third region where the strip-shaped folded sections of the respective packing bags are overlapped on each other; and

packing silicon in the inner bag of the plurality of packing bags,
whereby a high level of shock absorbing property can be attained on the entire bottom section, impacts and vibrations transmitted to the silicon stored inside can be uniformly distributed and absorbed, rubbing between the silicon and the packing bag can be prevented, and the generation of fine powder can be suppressed.

3. The method of packing silicon according claim 2 , wherein the inner bag and the outer bag are superimposed and displaced from each other by 90°.

4. A multiple-layer packing body for silicon consisting of: a plurality of transparent packing bags consisting of an inner bag and an outer bag, the inner bag being superposed in the outer bag, wherein
each packing bag is made of:
a substantially square bottom section;
a bottom sealed section;
a margin section at an upper end; and
four side face sections,

each bottom section is made of:
tucked sections each consisting of three sheets each having a substantially isosceles triangle shape in plan view; and
non-tucked sections between the tucked sections each consisting of a sheet each having a substantially isosceles triangle shape in plan view,

the tucked sections of one of the plurality of packing bags and the non-tucked sections of the other packing bag are stacked and constitute an entire bottom section of the packing body with four sheets,
each margin section forms a strip-shaped folded section by overlapping both opposing side face sections and folding several times,
a longitudinal direction of the strip-shaped folded section of the outer bag is orthogonally arranged to that of the inner bag, and
the strip-shaped folded sections of the respective packing bags are overlapped on each other in parallel to the bottom sealed section.

5. The multiple-layer packing body according claim 1 , wherein an outer diameter of the outer bag is slightly greater than that of the inner bag.

6. The multiple-layer packing body according claim 1 , wherein a constituent material of the outer bag contains a slip material.

7. The multiple-layer packing body according claim 1 , wherein respective tucked sections of the inner bag and the outer bag are superimposed and displaced from each other by 90°.

8. The multiple-layer packing body according claim 1 , wherein with the side face sections of the inner bag having no fold lines thereon and the side face sections of the outer bag having fold lines thereon overlapped on each other, and the side face sections of the inner bag having fold lines thereon and the side face sections of the outer bag having no fold lines thereon overlapped on each other, whereby each tucked section and each non-tucked section in the respective bottom sections make a pair and overlap on each other.

9. The multiple-layer packing body according claim 1 , wherein each packing body that internally stores polycrystalline silicon lump is stored in a transport case having a number of storage spaces which are further internally layered in a plurality of levels.

10. The multiple-layer packing body according claim 1 , wherein a fine powder is trapped in a folded part of the tucked section and the fine powder is held inside the inner bag, thereby the fine powder can be effectively removed.

Assignees

• Sasaki Go
• Mitsubishi Materials Corp

Inventors

• Sasaki Go

Classifications

• B65D81/03

  Wrappers or envelopes with shock-absorbing properties, e.g. bubble films {(for thermal insulating purposes B65D81/3888)} · CPC title

• B65D31/04 Primary

  with multiple walls (B65D81/3881 takes precedence; for shock absorbing purposes B65D81/03) · CPC title

• B65D31/08

  with block bottoms · CPC title

• B65D31/16

  of special shape · CPC title

• B65D71/40 Primary

  comprising a plurality of articles held together only partially by packaging elements formed by folding a blank {or several blanks} · CPC title