Manufacturing method of flat-plate heat pipe

US9987712B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9987712-B2
Application numberUS-201514676826-A
CountryUS
Kind codeB2
Filing dateApr 2, 2015
Priority dateApr 2, 2015
Publication dateJun 5, 2018
Grant dateJun 5, 2018

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  2. Abstract

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  5. First independent claim

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Abstract

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A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and water-filling section; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and water-filling section. By means of the manufacturing method of the flat-plate heat pipe, the flat-plate heat pipe can be formed with a thin thickness. After the flat-plate heat pipe is thinned, the flat-plate heat pipe still has a complete vapor passage.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of flat-plate heat pipe, comprising steps of: providing a first board body, a second board body, and a pair of opposed, elongate capillary structures; affixing the pair of capillary structures between the first board body and the second board body such that each capillary structure extends along a corresponding one of two opposed long side edges of the first and second board bodies and provides a working fluid sucking wick and support structure; overlapping and mating the first and second board bodies with each other and sealing open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and working fluid filling section, wherein the capillary structures and the first and second board bodies together define a medially arranged vapor passage where each capillary structure is disposed at one of two opposed long side edges of the medially arranged vapor passage wherein top surfaces of the pair of capillary structures are touching an inside surface of the first board body and bottom surfaces of the pair of capillary structures are touching an inside surface of the second board body; forming and disposing multiple channels on one side of the second board body opposite to the first board body by means of mechanical processing to form a heat absorption section arranged at only one end of the flat-plate heat pipe and between and adjacent inner long edges of each capillary structure and wherein the channels are only positioned on the heat absorption section and transversely and longitudinally intersect each other so that liquid working fluid can also go back to the heat absorption section in a radial direction Y; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and working fluid filling section. 2. The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the first and second board bodies are made of copper material. 3. The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the capillary structure is selected from a group consisting of sintered powder body, mesh body, linear braided body, fiber body and a combination thereof. 4. The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the open peripheries of the first and second board bodies are sealed by means of diffusion bonding, ultrasonic welding or spot welding. 5. The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the capillary structure is selectively affixed to the first board body or the second board body by means of diffusion bonding, ultrasonic welding or spot welding.

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What does patent US9987712B2 cover?
A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat t…
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23P15/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 05 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).