Process for manufacturing a printed circuit board
US-2015366071-A1 · Dec 17, 2015 · US
Process for the production of entry sheet for drilling and entry sheet
US9986644B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9986644-B2 |
| Application number | US-45788509-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2009 |
| Priority date | Dec 26, 2007 |
| Publication date | May 29, 2018 |
| Grant date | May 29, 2018 |
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- Title
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Abstract
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A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of these water-soluble resin composition layers, the multi-layered water-soluble resin composition layer has a thickness of at least 50 μm and is almost free from air bubbles, and an entry sheet for drilling a printed wiring board material obtained by the above process.
First claim
Opening claim text (preview).
What is claimed is: 1. An entry sheet for drilling a printed wiring board material, comprising a metal foil and a multi-layered water-soluble resin composition layer formed on at least one surface of the metal foil, wherein: the thickness of each water-soluble resin composition layer of the multi-layered water-soluble resin composition layer is in the range of 10 μm to 50 μm, the thickness of the multi-layered water-soluble resin composition layer is at least 50 μm and the number of air bubbles having a diameter of at least 30 μm each in the multi-layered water-soluble resin composition layer is 20 or less per an area of 100 mm ×100 mm, and each water-soluble resin composition layer comprises at least one selected from the group consisting of polyethylene oxide, polypropylene oxide, sodium polyacrylate, polyacrylamide, polyvinyl pyrrolidone, carboxymethyl cellulose, polytetramethylene glycol, polyether ester, and polyvinyl alcohol. 2. A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein: an aqueous solution of a water-soluble resin composition comprising at least one selected from the group consisting of polyethylene oxide, polypropylene oxide, sodium polyacrylate, polyacrylamide, polyvinyl pyrrolidone, carboxymethyl cellulose, polytetramethylene glycol, polyether ester, and polyvinyl alcohol is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the application, drying and solidification of the aqueous solution of the water-soluble resin composition are repeated at least once to form at least one water-soluble resin composition layer on the above one water-soluble resin composition layer, the multi-layered water-soluble resin composition layer is composed of the one water-soluble resin composition layer and the at least one water-soluble resin composition layer, the thickness of each water-soluble resin composition layer, formed by carrying out the application, drying and solidification of the aqueous solution of the water-soluble resin composition, once, is in the range of 10 μm to 50 μm, and the thickness of the multi-layered water-soluble resin composition layer is at least 50 μm and the number of air bubbles having a diameter of at least 30 μm each in the multi-layered water-soluble resin composition layer is 20 or less per an area of 100 mm ×100 mm.
Assignees
Inventors
Classifications
Using an aqueous solution, e.g. for cleaning or during drilling of holes · CPC title
- H05K3/0047Primary
Drilling of holes · CPC title
Back-up or entry material, e.g. for mechanical drilling · CPC title
Lubricants, e.g. during drilling of holes · CPC title
Composite having voids in a component [e.g., porous, cellular, etc.] · CPC title
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- What does patent US9986644B2 cover?
- A process for the production of an entry sheet for drilling a printed wiring board material, which process comprises forming a multi-layered water-soluble resin composition layer on at least one surface of a metal foil, wherein an aqueous solution of a water-soluble resin composition is applied to the metal foil, dried and solidified to form one water-soluble resin composition layer, the applic…
- Who is the assignee on this patent?
- Matsuyama Yousuke, Akita Reiki, Hasaki Takuya, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/0047. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 29 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).