LED package structure

Patent metadata

Field	Value
Publication number	US-9985191-B2
Application number	US-201615231214-A
Country	US
Kind code	B2
Filing date	Aug 8, 2016
Priority date	Mar 14, 2016
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

An LED package structure includes a ceramic substrate, a ceramic board, a light-emitting unit, a first adhesive layer, a second adhesive layer, and a cover. The ceramic board having a thru-hole is disposed on the ceramic substrate. The light-emitting unit is disposed on the ceramic substrate and is arranged in the thru-hole of the ceramic board. The first and second adhesive layers are disposed on the ceramic board, and the second adhesive layer covers the first adhesive layer. The cover is fixed on the ceramic board by the first and second adhesive layers. Thus, the shearing force of the LED package structure of the instant disclosure is increased by having the first and second adhesive layers, which are connected to each other.

First claim

What is claimed is:

1. An LED package structure, comprising:
a ceramic substrate having a top surface and a bottom surface;
a ceramic board having a thru-hole, the ceramic board disposed on the top surface of the ceramic substrate;
a metallic layer disposed on the top surface of the ceramic substrate;
a soldering layer disposed on the bottom surface of the ceramic substrate;
a plurality of conductive pillars embedded in the ceramic substrate and electrically connecting the metallic layer to the soldering layer;
a light-emitting unit disposed above the ceramic substrate and arranged in the thru-hole, wherein the light-emitting unit is electrically connected to the metallic layer and the soldering layer;
a first adhesive layer disposed on the ceramic board;
a second adhesive layer stacked on the first adhesive layer, wherein the first adhesive layer is entirely embedded in the second adhesive layer, and a top surface of the first adhesive layer is entirely adhered to the second adhesive layer; and
a cover fixed on the ceramic board through the first adhesive layer and the second adhesive layer.

2. The LED package structure as claimed in claim 1 , wherein the cover is a plate-like covering plate, the covering plate is fixed on the ceramic board through the first adhesive layer and the second adhesive layer to protect the light-emitting unit.

3. The LED package structure as claimed in claim 1 , wherein the light-emitting unit further comprises a lens, and the lens is disposed on a light-emitting surface of an UV LED chip.

4. The LED package structure as claimed in claim 1 , wherein the light-emitting unit further comprises a submount disposed on the ceramic substrate and an UV LED chip disposed on the submount, the metallic layer has a positive electrode pad and a negative electrode pad spaced apart from each other, the light-emitting unit is electrically connected to the positive electrode pad and the negative electrode pad by wire-bonding.

5. The LED package structure as claimed in claim 4 , wherein the light-emitting unit has a lens disposed on the submount to encapsulate the UV LED chip.

6. The LED package structure as claimed in claim 1 , wherein the first adhesive layer is an UV curable resin, the second adhesive layer is an UV curable resin or a heat curable resin.

7. The LED package structure as claimed in claim 1 , wherein the first adhesive layer has a plurality of first adhesive portions, the second adhesive layer has a plurality of second adhesive portions respectively covering the plurality of first adhesive portions, a surface of each of the first adhesive portions, connected to the corresponding second adhesive portion, is a ripple surface.

8. The LED package structure as claimed in claim 1 , wherein the ceramic board and the cover are provided without any gap there-between through the first adhesive layer and the second adhesive layer, and an inner space of the LED package structure constructed by the ceramic substrate, the ceramic board and the cover is isolated from an outer space.

9. An LED package structure, comprising:
a ceramic substrate having a top surface and a bottom surface;
a metallic layer disposed on the top surface of the ceramic substrate;
a soldering layer disposed on the bottom surface of the ceramic substrate;
a plurality of conductive pillars embedded in the ceramic substrate and electrically connecting the metallic layer to the soldering layer;
a light-emitting unit disposed above the ceramic substrate and electrically connected to the metallic layer and the soldering layer;
a first adhesive layer disposed on the ceramic substrate;
a second adhesive layer stacked on the first adhesive layer, wherein the second adhesive layer has a concavity, the first adhesive layer is entirely embedded in the concavity of the second adhesive layer, and a top surface of the first adhesive layer is entirely adhered to an inner surface of the concavity of the second adhesive layer; and
a cover having a translucent covering plate and a ring-shaped frame connected to the covering plate, wherein an end of the frame away from the covering plate is fixed on the ceramic substrate through the first adhesive layer and the second adhesive layer.

10. The LED package structure as claimed in claim 9 , wherein the light-emitting unit further comprises a submount disposed on the ceramic substrate and an UV LED chip disposed on the submount.

11. The LED package structure as claimed in claim 10 , wherein the light-emitting unit has a lens disposed on a light-emitting surface of the UV LED chip.

12. The LED package structure as claimed in claim 10 , wherein the light-emitting unit has a lens disposed on the submount to encapsulate the UV LED chip.

13. The LED package structure as claimed in claim 9 , wherein each of the covering plate and the frame is made of a translucent material, an angle between a bottom surface of the covering plate and an inner side surface of the frame is approximately 90 degrees, a reflecting layer is selectively formed on the inner side surface of the frame; the first adhesive layer is an UV curable resin, the second adhesive layer is an UV curable resin or a heat curable resin.

14. The LED package structure as claimed in claim 9 , wherein the covering plate is made of a translucent material, the frame is made of metal or silicon, an angle between a bottom surface of the covering plate and an inner side surface of the frame is smaller than 90 degrees, a reflecting layer is selectively formed on the inner side surface of the frame; the first adhesive layer is an UV curable resin, the second adhesive layer is a heat curable resin.

15. The LED package structure as claimed in claim 9 , wherein at least one gap is formed between the ceramic substrate and the cover, and an inner space of the LED package structure constructed by the ceramic substrate and the cover is in air communication with an outer space via the at least one gap.

16. The LED package structure as claimed in claim 15 , wherein the first adhesive layer has a plurality of first adhesive portions, the second adhesive layer has a plurality of second adhesive portions respectively covering the first adhesive portions, and a surface of each of the first adhesive portions, connected to the corresponding second adhesive portion, is a ripple surface.

17. The LED package structure as claimed in claim 16 , further comprising a plurality of L-shaped light-shielding portions disposed on the top surface of the ceramic substrate, wherein the plurality of light-shielding portions are arranged adjacent to the first adhesive layer and the second adhesive layer, and a height of each of the light-shielding portions is greater than or identical to that of the first adhesive layer and the second adhesive layer.

18. The LED package structure as claimed in claim 9 , wherein the ceramic substrate and the cover are provided without any gap there-between by using the first adhesive layer and the second adhesive layer, and an inner space of the LED package structure constructed by the ceramic substrate and the cover is isolated from an outer space.

19. The LED package structure as claimed in claim 18 , further comprising a ring-shaped light-shielding portion disposed on the top surface of the ceramic substrate, wherein the light-shielding portion is arranged adjacent to the first adhesive layer and the second adhesive layer, and a height of the light-shielding portion is greater than or identical to that of the first adhesive layer and the second adhesive layer.

Assignees

• Lite On Opto Tech Changzhou Co Ltd
• Lite On Technology Corp

Inventors

• Chiu Kuo-Ming
• Chou Meng-Sung
• Chen Hung-Jui
• Peng Han-Hsing

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01L33/486

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic

• H01L33/62 Primary

  Electricity · mapped topic

• H01L33/58

  Electricity · mapped topic