Adhesive layer-equipped transparent surface material, display device and processes for their production
US-2017174961-A1 · Jun 22, 2017 · US
US9985137B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9985137-B2 |
| Application number | US-201415104726-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 16, 2014 |
| Priority date | Dec 16, 2013 |
| Publication date | May 29, 2018 |
| Grant date | May 29, 2018 |
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It is an object of the invention to provide a thin film transistor and a method for producing the same, which will easily achieve self-aligned formation of a source/drain region without through processes under a vacuum or a low pressure or with no use of expensive equipment. An exemplary method for producing a thin film transistor according to the invention includes an aliphatic polycarbonate layer forming step of forming an aliphatic polycarbonate layer 50 that covers a gate electrode layer 40 disposed above a semiconductor layer 20 with a gate insulator 30 being interposed between the gate electrode layer 40 and the semiconductor layer 20 , and also covers the semiconductor layer 20 , and has a dopant causing the semiconductor layer 20 to become an n-type or p-type semiconductor layer, and a heating step of heating at a temperature causing introduction of the dopant into the semiconductor layer 20 and decomposition of the aliphatic polycarbonate layer 50.
Opening claim text (preview).
The invention claimed is: 1. An intermediate semiconductor device comprising: a gate electrode layer disposed above a semiconductor layer with a gate insulator being interposed between the gate electrode layer and the semiconductor layer; and an aliphatic polycarbonate layer that covers the gate electrode layer and a portion of the semiconductor layer, the aliphatic polycarbonate layer comprising a dopant. 2. The intermediate semiconductor device according to claim 1 , wherein the semiconductor layer is a first material layer, the first material layer is an oxide layer including one, two, or more metals selected from the group consisting of indium (In), tin (Sn), zinc (Zn), cadmium (Cd), zirconium (Zr), gallium (Ga), antimony (Sb), and copper (Cu), or a layer including a member selected from the group consisting of silicon (Si) and a silicon compound, and the dopant is an n-type dopant, and includes one, two, or more elements selected from the group consisting of tin (Sn), fluorine (F), antimony (Sb), indium (In), gallium (Ga), phosphorus (P), arsenic (As), and aluminum (Al). 3. The intermediate semiconductor device according to claim 1 , wherein the semiconductor layer is a second material layer, the second material layer is an oxide layer or a sulfide layer including one, two, or more metals selected from the group consisting of copper (Cu), aluminum (Al), gallium (Ga), strontium (Sr), lanthanum (La), selenium (Se), zinc (Zn), zirconium (Zr), and antimony (Sb), or a layer including a member selected from the group consisting of silicon (Si) and a silicon compound, and the dopant is a p-type dopant, and includes one, two, or more elements selected from the group consisting of tin (Sn), fluorine (F), antimony (Sb), indium (In), gallium (Ga), aluminum (Al), boron (B), and magnesium (Mg). 4. The intermediate semiconductor device according to claim 1 , wherein the aliphatic polycarbonate is at least one member selected from the group consisting of polyethylene carbonate and polypropylene carbonate. 5. An aliphatic polycarbonate layer covering a gate electrode layer disposed above a semiconductor layer with a gate insulator being interposed between the gate electrode layer and the semiconductor layer, the aliphatic polycarbonate layer comprising a dopant which, when heated at a decomposition temperature of the aliphatic polycarbonate layer, is disposed to be introduced into the semiconductor layer to form a source electrode and a drain electrode of a semiconductor device. 6. The aliphatic polycarbonate layer according to claim 5 , wherein the aliphatic polycarbonate layer is composed of at least one member selected from the group consisting of polyethylene carbonate and polypropylene carbonate. 7. The aliphatic polycarbonate layer according to claim 5 , wherein the aliphatic polycarbonate layer is composed of polypropylene carbonate, and an amount of the dopant is 0.05 mol or more and 0.1 mol or less with respect to 1 kg of the polypropylene carbonate alone.
Thermal treatments, e.g. annealing or sintering · CPC title
characterised by the semiconductor material · CPC title
within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase · CPC title
Coating compositions based on polycarbonates; Coating compositions based on derivatives of polycarbonates · CPC title
Temporary coatings (C09D5/20 takes precedence) · CPC title
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