Housing of electronic module, electronic module, light emitting module and backlight module

US9982869B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9982869-B2
Application numberUS-201214238212-A
CountryUS
Kind codeB2
Filing dateAug 10, 2012
Priority dateAug 15, 2011
Publication dateMay 29, 2018
Grant dateMay 29, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.

First claim

Opening claim text (preview).

The invention claimed is: 1. A housing of an electronic module, comprising: a mounting surface located at one side of the housing, wherein the mounting surface comprises at least three sub-mounting surfaces, wherein the sub-mounting surfaces comprise one first sub-mounting surface with a first area and two second sub-mounting surfaces with second areas, wherein the first sub-mounting surface is located in a central area of the housing, and wherein the first area is larger than the second areas, and lines connecting the centers of respective sub-mounting surfaces form a polygon, and an entire mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon for a fixing member configured to fix the housing; wherein the entire mounting hole is opened in the central area of the polygon. 2. The housing according to claim 1 , wherein the distance between a plane at a mounting surface side where the mounting hole is located and a light emitting plane of the electronic module is smaller than the distance between the respective sub-mounting surfaces and the light emitting plane of the electronic module. 3. The housing according to claim 1 , wherein the number of the sub-mounting surfaces is three, and the lines connecting the centers of the respective sub-mounting surfaces form a triangle. 4. The housing according to claim 1 , wherein the first sub-mounting surface is a symmetrical design having the same symmetry axis as that of the housing. 5. The housing according to claim 3 , wherein the triangle is an isosceles triangle and the first sub-mounting surface is connected with the respective second sub-mounting surfaces to form two equal sides of the isosceles triangle. 6. The housing according to claim 1 , wherein at least a convex-concave structure is formed on the second sub-mounting surfaces. 7. The housing according to claim 1 , wherein the first and second sub-mounting surfaces are level with each other. 8. The housing according to claim 1 , wherein the housing further comprises a double side tape layer adhered on the first sub-mounting surface. 9. The housing according to claim 1 , wherein the mounting hole is a screw hole. 10. The housing according to claim 1 , wherein the fixing member includes a screw. 11. A light emitting module, comprising an electronic module, comprising a housing, the housing comprising a mounting surface located at one side of the housing, wherein the mounting surface comprises at least three sub-mounting surfaces, wherein the sub-mounting surfaces comprise one first sub-mounting surface with a first area and two second sub-mounting surfaces with second areas, wherein the first sub-mounting surface is located in a central area of the housing, and wherein the first area is larger than the second areas, and lines connecting the centers of respective sub-mounting surfaces form a polygon, and an entire mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon for a fixing member configured to fix the housing; wherein the entire mounting hole is opened in the central area of the polygon. 12. A backlight module, comprising a plurality of light emitting modules connected in serials, the light emitting module comprising an electronic module, the electronic module comprising a housing, the housing comprising a mounting surface located at one side of the housing, wherein the mounting surface comprises at least three sub-mounting surfaces, wherein the sub-mounting surfaces comprise one first sub-mounting surface with a first area and two second sub-mounting surfaces with second areas, wherein the first sub-mounting surface is located in a central area of the housing, and wherein the first area is larger than the second areas, and lines connecting the centers of respective sub-mounting surfaces form a polygon, and an entire mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon for a fixing member configured to fix the housing; wherein the entire mounting hole is opened in the central area of the polygon.

Assignees

Inventors

Classifications

  • including particular frames or supporting means · CPC title

  • Light-emitting diodes [LED] · CPC title

  • F21V15/01Primary

    Housings, e.g. material or assembling of housing parts (F21V15/02 takes precedence {housings forming signs or letters G09F13/04}) · CPC title

  • Details · CPC title

  • F21S4/24Primary

    of ribbon or tape form, e.g. LED tapes · CPC title

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Frequently asked questions

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What does patent US9982869B2 cover?
A housing of an electronic module may include: a mounting surface located at one side of the housing, wherein the mounting surface includes at least three sub-mounting surfaces, lines connecting the centers of respective sub-mounting surfaces form a polygon, and a mounting hole extending from one side of the housing to the other side thereof and being opened within an area of the polygon.
Who is the assignee on this patent?
Feng Yaojun, He Yuanyuan, He Yubao, and 3 more
What technology area does this patent fall under?
Primary CPC classification F21V15/01. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 29 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).