Thermocompression-bonding filament nonwoven fabric having excellent molding properties

US9982375B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9982375-B2
Application numberUS-201314439753-A
CountryUS
Kind codeB2
Filing dateOct 31, 2013
Priority dateNov 2, 2012
Publication dateMay 29, 2018
Grant dateMay 29, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a thermocompression-bonding filament nonwoven fabric, which is inexpensive, has excellent molding properties and design properties, and is suitable as surface materials for automotive acoustic absorbing materials. The thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric has a weight of 20 to 80 g/m 2 , a sum of 5% tensile loads in a MD and CD per weight of 1.0 to 1.9 (N/5 cm)/(g/m 2 ), and a 180° C. dry heat shrinkage of 3.5% or less in both the MD and CD, and is not mechanically interlaced.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric has a weight of 20 to 80 g/m 2 , a sum of 5% tensile loads in MD and CD per weight of 1.0 to 1.9 (N/5 cm)/(g/m 2 ), and a 180° C. dry heat shrinkage of 3.5% or less in both the MD and CD, and is not mechanically interlaced. 2. The thermocompression-bonding filament nonwoven fabric according to claim 1 , wherein the polyester-based resin comprises a polyethylene terephthalate and from more than 0 wt % to 2.0 wt % of a styrene-methyl methacrylate-maleic anhydride copolymer resin or styrene-maleic acid copolymer resin. 3. The thermocompression-bonding filament nonwoven fabric according to claim 1 , having an apparent density of from 0.12 to 0.20 g/cm 3 . 4. The thermocompression-bonding filament nonwoven fabric according to claim 2 , having an apparent density of from 0.12 to 0.20 g/cm 3 .

Assignees

Inventors

Classifications

  • polymers of unsaturated carboxylic acids or unsaturated organic esters, e.g. polyacrylic esters, polyvinyl acetate · CPC title

  • polyesters, e.g. polyethylene terephthalate [PET] · CPC title

  • with bonds between thermoplastic yarns or filaments produced by welding · CPC title

  • of polyesters · CPC title

  • D04H3/011Primary

    Polyesters · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9982375B2 cover?
Provided is a thermocompression-bonding filament nonwoven fabric, which is inexpensive, has excellent molding properties and design properties, and is suitable as surface materials for automotive acoustic absorbing materials. The thermocompression-bonding filament nonwoven fabric comprising a polyester-based resin having a melting point of 250° C. or more, wherein the filament nonwoven fabric h…
Who is the assignee on this patent?
Toyo Boseki
What technology area does this patent fall under?
Primary CPC classification D04H3/011. Mapped technology areas include Textiles & Paper.
When was this patent published?
Publication date Tue May 29 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).