Metal oxide-polymer composite particles for chemical mechanical planarization

Patent metadata

Field	Value
Publication number	US-9982166-B2
Application number	US-201415104274-A
Country	US
Kind code	B2
Filing date	Dec 16, 2014
Priority date	Dec 20, 2013
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

CMP processes, tools and slurries utilize metal oxide-polymer composite particles that include metal oxide particles and a polymer core. The metal oxide particles are modified with a modifying agent and are partially or fully embedded within the polymer core. Using these processes, tools and slurries can enhance removal rates, reduce defectivity and increase cleanability with respect to comparable systems and substrates.

First claim

What is claimed is:

1. A process for removing material from a substrate through chemical and abrasive actions, the process comprising:
removing material from a substrate with a polishing pad or slurry composition, wherein the polishing pad, or the slurry composition, or both include metal oxide-polymer composite particles that comprise a plurality of metal oxide particles and a polymer core, to produce a processed surface, wherein:
the metal oxide particles are modified with a bifunctional modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core, and
at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

2. The process of claim 1 , further comprising cleaning the processed surface.

3. The process of claim 1 , wherein the polymer core includes a polymer that is the same or different from the modifying agent.

4. The process of claim 1 , wherein a portion of the metal oxide particles are fully embedded within the polymer core.

5. The process of claim 1 , wherein the metal oxide-polymer composite particles further include one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

6. The process of claim 1 , wherein the CMP slurry composition further comprises a surfactant, a rheological agent, a corrosion inhibitor, an oxidizing agent, a chelating agent, a complexing agent, particles other than the metal oxide-polymer composite particles, or any combination thereof.

7. A CMP slurry composition comprising metal oxide-polymer composite particles dispersed in an aqueous media, the metal oxide-polymer composite particles including a plurality of metal oxide particles and a polymer core, wherein:
the metal oxide particles are modified with a bifunctional modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core, and
at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

8. The CMP slurry composition of claim 7 , wherein the polymer core comprises a polymer or copolymer of the modifying agent.

9. The CMP slurry composition of claim 7 , wherein the metal oxide-polymer composite particles are treated with at least one additional modifying agent.

10. The CMP slurry composition of claim 7 , wherein the metal oxide-polymer particles have a volume average diameter within the range of from about 20 nm to about 500 nm.

11. The CMP slurry composition of claim 7 , wherein the polymer core comprises polymers of styrene, unsubstituted or substituted acrylates or methacrylates, olefins, vinyl esters, and acrylonitrile and copolymers and mixtures of the above.

12. The CMP slurry composition of claim 7 , wherein the metal oxide particles comprise precipitated, pyrogenic, or sol gel metal oxide particles, or mixtures of two or more of these.

13. The CMP slurry composition of claim 7 , wherein the metal oxide particles are selected from the group consisting of silica, alumina, ceria, titania, zirconia, zinc oxide, an iron oxide, niobium oxide, vanadium oxide, tungsten oxide, tin oxide, barium oxide, strontium oxide, calcium oxide, magnesium oxide, a phosphorus oxide, mixtures and mixed oxides of any two or more of these.

14. The CMP slurry composition of claim 7 , wherein the metal oxide includes fumed silica.

15. The CMP slurry composition of claim 7 , wherein the metal oxide-polymer composite particles further comprise one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

16. The CMP slurry composition of claim 7 , wherein the polymer core includes an inorganic material that is different in composition from the metal oxide.

17. A CMP polishing pad comprising metal oxide-polymer composite particles that include a plurality of metal oxide particles and a polymer core, wherein:
the metal oxide particles are modified with a bifunctional modifying agent, and
at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

18. The CMP polishing pad of claim 17 , wherein the metal oxide particles are modified with a modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core.

19. The CMP polishing pad of claim 17 , wherein the metal oxide-polymer composite particles further include one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent.

20. A metal oxide-polymer composite particle comprising:
a plurality of metal oxide particles;
a polymer core, the metal oxide particles being modified with a modifying agent via which the metal oxide particles are covalently attached to the polymer in the polymer core; and
one or more ingredients selected from the group consisting of a CMP chemical etchant, a CMP processing accelerator, and a CMP passivating agent,
wherein at least a portion of the metal oxide particles are partially embedded within the polymer core and project out from the polymer core.

21. The metal oxide-polymer composite particle of claim 20 , wherein a portion of the metal oxide particles are fully embedded within the polymer core.

22. The CMP slurry composition of claim 7 , wherein a portion of the metal oxide particles are fully embedded within the polymer core.

23. The CMP polishing pad of claim 17 , wherein a portion of the metal oxide particles are fully embedded within the polymer core.

Assignees

• Cabot Corp

Inventors

• Prevo Brian G
• Hampden-Smith Mark J
• Fomitchev Dmitry
• Kutsovsky Yakov E

Classifications

• C09G1/16 Primary

  on natural or synthetic resins · CPC title

• C09G1/02

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• C09K3/1463

  Aqueous liquid suspensions · CPC title

• C08F130/08

  containing silicon · CPC title

• C09K3/1436

  Composite particles, e.g. coated particles · CPC title