Converter arrangement with a capacitor arrangement

Patent metadata

Field	Value
Publication number	US-9980414-B2
Application number	US-201514683900-A
Country	US
Kind code	B2
Filing date	Apr 10, 2015
Priority date	Apr 10, 2014
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A power converter arrangement comprising: a housing having first and second chambers separated by a separating body; a power semiconductor module; and a device. The capacitor is electrically conductively connected to power semiconductor module by a connecting device. Power semiconductor module, the connecting device and connection elements of the capacitor are arranged in first chamber. The capacitor reaches through the separating body between the first and second chambers into second chamber for cooling of the capacitor. The separating body has a first cutout through which the capacitor reaches. A flat, elastic sealing body which runs peripherally around the first cutout and reaches into the region of the first cutout and surrounds the capacitor there in sealing fashion, is arranged on a surface of the separating body. A pressing body presses the sealing body against the separating body and terminates in sealing fashion there.

First claim

What is claimed is:

1. A power converter arrangement comprising:
a housing having first and second chambers;
a separating body for separating said first and second chambers, said separating body having a cutout;
a power semiconductor module disposed in said first chamber;
a capacitor device having connection elements disposed in said first chamber, said capacitor device being disposed to reach through said cutout of said separating body into said second chamber for cooling of said capacitor device;
a connecting device for electrically conductively connecting said power semiconductor module to said capacitor device, said connecting device being disposed in said first chamber;
a flat elastic sealing body which runs peripherally around said cutout and is arranged on a surface of said separating body, said sealing body reaching into an opening of said cutout and surrounding said capacitor device there in sealing fashion, said flat sealing body extending outwardly from said opening; and
a sheet-like pressing body which presses said flat sealing body against said separating body and terminates in sealing fashion there.

2. The power converter arrangement of claim 1 , wherein said cutout has a diameter which is greater than a diameter of said capacitor device together with said sealing body lying thereon.

3. The power converter arrangement of claim 1 , wherein said sealing body forms a first sealing surface with said capacitor device and is thereby connected to said capacitor device in a form-fitting manner.

4. The power converter arrangement of claim 1 , wherein said pressing body is configured to force-fittingly connect said sealing body to said separating body on a second sealing surface.

5. The power converter arrangement of claim 1 , wherein said second chamber is configured to receive cooling air and to permit said cooling air to flow through it.

6. The power converter arrangement of claim 1 , further comprising a cooling device, said cooling device being disposed so as to reach into said second chamber and to receive said power semiconductor module thereon, said cooling device sealing said second chamber from said first chamber.

7. The power converter arrangement of claim 1 , wherein said separating body is formed as a metallic molded body which includes a U-shaped metal sheet, whose side walls form walls of at least one of said first and second chambers.

8. The power converter arrangement of claim 1 , wherein said sealing body is made of an elastomer, having a modulus of elasticity of between about 1.0 MPa and about 3.5 MPa.

9. The power converter arrangement of claim 1 , wherein said sealing body has a modulus of elasticity of between about 1.0 MPa and about 3.5 MPa.

10. The power converter arrangement of claim 9 , wherein said modulus of elasticity of said sealing body is between about 1.8 MPa and about 2.5 MPa.

11. The power converter arrangement of claim 1 , wherein said sealing body has a thickness of between about 0.2 mm and about 3.0 mm.

12. The power converter arrangement of claim 11 , wherein said sealing body has a thickness of between about 1.4 mm and about 2.0 mm.

13. The power converter arrangement of claim 1 , further comprising an actuation device which is electrically connected to said power semiconductor module and is disposed in said first chamber.

14. The power converter arrangement of claim 13 , further comprising a sensor device which is disposed in said first chamber.

15. The power converter arrangement of claim 1 , further comprising a sensor device which is disposed in said first chamber.

16. The power converter arrangement of claim 1 , wherein said capacitor device is surrounded in sealing fashion by said sealing body over a length of between about 2 mm and about 30 mm.

17. The power converter arrangement of claim 16 , wherein said length over which said capacitor device is surrounded by said sealing body is between about 10 mm and about 25 mm.

18. The power converter arrangement of claim 1 , wherein said capacitor device has a generally round cross-section in that region thereof which is surrounded by said sealing body and where a first sealing surface is formed.

19. The power converter arrangement of claim 1 , wherein said capacitor device has a generally oval cross-section in that region thereof which is surrounded by said sealing body and where a first sealing surface is formed.

20. The power converter arrangement of claim 1 , wherein said sealing body reaches inwardly into said region of said cutout from edges of said cutout, and has an open cross-section which is less than a cross-section of said cutout.

Assignees

• Semikron Elektronik Gmbh & Co Kg

Inventors

• Hebert Mathieu

Classifications

• H05K7/20918 Primary

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

• H05K7/20909

  Forced ventilation, e.g. on heat dissipaters coupled to components · CPC title