Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device

Patent metadata

Field	Value
Publication number	US-9980392-B2
Application number	US-201615262404-A
Country	US
Kind code	B2
Filing date	Sep 12, 2016
Priority date	Mar 14, 2014
Publication date	May 22, 2018
Grant date	May 22, 2018

Abstract

A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.

First claim

The invention claimed is:

1. A production process for producing a substrate having wiring, the production process comprising:
applying a radiation-sensitive composition on a substrate to form a coating film,
irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region,
allowing the coating film to have a concave region and a convex region by heating the coating film without employing a development,
forming wiring on the concave region, and
removing the convex region by an application of radiation or by heating.

2. The production process according to claim 1 , wherein the radiation-sensitive composition comprises: a compound having an acid-dissociable group; and an acid generator.

3. The production process according to claim 2 , wherein the acid-dissociable group comprises a fluorine atom.

4. The production process according to claim 2 , wherein the acid-dissociable group comprises at least one bond selected from the group consisting of an acetal bond and a hemiacetal ester bond.

5. The production process according to claim 4 , wherein the acid-dissociable group comprises at least one group selected from the group consisting of a group represented by Formula (1-1) and a group represented by Formula (1-2):

wherein in Formulae (1-1) and (1-2), R 1 and R 2 are each independently a hydrogen atom or a methyl group; each Rf is independently an organic group having a fluorine atom; and * is a bonding site.

6. The production process according to claim 2 , wherein the compound having an acid-dissociable group comprises at least one unit selected from the group consisting of structural units represented by Formulae (2) to (6):

wherein in Formulae (2) to (6), each R 3 is independently a hydrogen atom or a methyl group; each R 4 is independently a methylene group, a C2-12 alkylene group, a C2-12 alkenylene group, a C6-13 substituted or unsubstituted aromatic hydrocarbon group, a C4-12 substituted or unsubstituted alicyclic hydrocarbon group, or a group in which at least one hydrogen atom of these groups is substituted with a fluorine atom; each R 5 is independently a group in which at least one hydrogen atom of a hydrocarbon group is substituted with a fluorine atom; m is 0 or 1; and each n is independently an integer of from 0 to 12.

7. The production process according to claim 1 , wherein the forming of wiring comprises: applying a wiring-forming material on the concave region; and thereafter heating the wiring-forming material and/or irradiating the wiring-forming material with radiation.

8. The production process according to claim 1 , wherein a difference between a surface of the concave region and a surface of the convex region in contact angle with respect to tetradecane is 30° or more.

9. The production process according to claim 1 , wherein the concave region has a film thickness that is reduced by 10% or more as compared with a film thickness of the convex region.

10. The production process according to claim 1 , wherein the radiation-sensitive composition comprises a polymerizable compound having an ethylenic unsaturated bond.

Assignees

• Jsr Corp

Inventors

• Hamaguchi Hitoshi
• Tanaka Kenrou
• Ookita Kenzou
• Kuriyama Keisuke

Classifications

• G03F7/0046

  with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title

• G03F7/40

  Treatment after imagewise removal, e.g. baking · CPC title

• G03F7/0392

  the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

• G03F7/36

  Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma · CPC title

• H05K3/107 Primary

  by filling grooves in the support with conductive material (H05K3/045, H05K3/101, H05K3/1258 and H05K3/465 take precedence) · CPC title